Conveying system for vacuum reflow soldering furnace

Abstract

The invention relates to a conveying system for a vacuum reflow soldering furnace. The system is characterized by comprising an in-furnace transmission device, a vacuum device and a track width adjusting device. The in-furnace transmission device comprises at least one in-furnace transmission track; the vacuum device comprises a shell, a vacuum transmission module, a front door connecting shaft, a rear door connecting shaft, a first connecting shaft, a second connecting shaft and a plurality of transition shafts, and the positions of the vacuum transmission track and the in-furnace transmission track are collinearly corresponding one by one; the track width adjusting device is connected with each conveying chain in the in-furnace conveying track and each vacuum conveying chain in the vacuum conveying track, and the distance between the two conveying chains in the in-furnace conveying track and the distance between the two vacuum conveying chains in the vacuum conveying track which are collinearly corresponding to the in-furnace conveying track are synchronously adjusted. Compared with the prior art, the in-furnace conveying track in the in-furnace conveying device and the vacuum conveying track in the vacuum conveying module achieve a synchronous width adjusting function.

Description

technical field [0001] The invention relates to a welding supporting equipment, in particular to a conveying system for a vacuum reflow oven. Background technique [0002] The reflow oven is a device that provides a heating environment to melt the solder paste by heating, so that the surface mount components and the circuit board are reliably bonded together through the solder paste alloy. Vacuum reflow oven is the key equipment of surface mount technology in electronics manufacturing industry. Its quality and operation directly affect the quality of the final product. Once the soldering process is completed, if you want to repair defective solder joints, components or circuit boards It will be very complicated and expensive. [0003] With the development of the electronics industry towards miniaturization and multi-specification, the requirements for product quality are getting higher and higher. In order to meet the new needs of the market and reduce product defects cause...

AI Technical Summary

Problems solved by technology

However, since this three-stage split transmission is independent of each other, complex software cooperation is required to achieve precise cooperation with each other, and the reliability is poor.

At the same time, when producing different types of components and circuit boards, it is very inconvenient to adjust the bandwidth of the conveyor belt, and manual adjustments are required, especially between the conveyor belt inside the vacuum device and the conveyor belt of the reflow oven. Achieve synchronous width adjustment, inconvenient to use

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