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Electronic equipment, circuit board and preparation method thereof

A circuit board and circuit technology, which is applied in circuit substrate materials, metal core circuit manufacturing, circuit devices, etc., can solve the problems of limited and difficult to pass, to meet the heat dissipation requirements, improve the current carrying capacity, and ensure the service life. Effect

Active Publication Date: 2022-07-12
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the purposes of the embodiments of the present application is to provide a circuit board, which aims to solve the technical problem in the prior art that it is difficult to pass a large current due to the limited line width and thickness.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Please also refer to figure 1 and figure 2 , the circuit board provided by the embodiment of the present application includes a dielectric board 1 , a circuit layer 2 , a metal substrate 3 and a current-carrying member 4 .

[0042] The dielectric board 1 is an insulating board, which is made of PP material here. The circuit layer 2 is arranged on one side of the dielectric board 1 along the first direction y, and the circuit layer 2 has a first circuit 221. It should be noted here that the circuit layer 2 includes a large current area 21 and a small current area 22. A line 221 is provided on the small current area 22, and the first line 221 is used for passing a small current. The metal substrate 3 is disposed on the other side of the dielectric plate 1 along the first direction y, that is, the metal substrate 3 and the circuit layer 2 are respectively disposed on opposite sides of the dielectric plate 1 along the first direction y. The first direction y is the dist...

Embodiment 2

[0057] Please also refer to image 3 and Figure 4 , the difference between this embodiment and the first embodiment is that the circuit board includes at least two circuit layers 2, a core board 6 is stacked along the first direction y between two adjacent circuit layers 2, and one of the circuit layers 2 is arranged on the medium board 1. The current-carrying member 4 penetrates through the dielectric board 1 , the core board 6 and at least two circuit layers 2 .

[0058] in, image 3 The circuit board shown in the figure is a double-layer board, with two circuit layers 2, a core board 6 is stacked between the two circuit layers 2, and one of the circuit layers 2 is arranged on the dielectric board 1, and the current-carrying member 4 It runs through the two circuit layers 2 and the core board 6 .

[0059] Figure 4 The circuit board shown in is an eight-layer board, and the circuit layers 2 are eight. The eight circuit layers 2 are stacked in sequence along the first d...

Embodiment 3

[0062] see Figure 5 , an embodiment of the present application also provides a method for preparing a circuit board. The circuit board in the above-mentioned embodiment 1 or embodiment 2 is made by the method for preparing a circuit board in this embodiment. For the board, refer to the circuit boards described in Embodiment 1 and Embodiment 2. For the specific structure of the circuit board, please refer to the related description of the circuit board in Embodiment 1 or Embodiment 2, which will not be repeated here.

[0063] Wherein, the preparation method of the circuit board in this embodiment includes the following steps:

[0064] S1. Prepare the medium plate 1, and make holes on the medium plate 1;

[0065] S2, prepare a metal substrate 3, and form a current-carrying member 4 on the metal substrate 3;

[0066]In this embodiment, when the current-carrying member 4 and the metal substrate 3 are integrally connected, a boss is formed on the metal substrate 3 , and the boss...

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Abstract

The present application provides an electronic device, a circuit board and a preparation method thereof. The circuit board includes: a dielectric board; a circuit layer is provided on one side of the dielectric board, and the circuit layer has a first circuit for passing a small current; a metal The substrate is arranged on the other side of the dielectric plate; the current-carrying member penetrates through the dielectric plate and extends out of one side of the dielectric plate to be spaced apart from the first circuit; the current-carrying member is connected to the metal substrate and is used for the passage of large current. The preparation method of the circuit board includes: preparing a dielectric plate, preparing a metal substrate, pressing the dielectric plate and the metal substrate, so that the current-carrying member penetrates the dielectric plate, and a circuit layer is formed on the dielectric plate; the electronic equipment includes the circuit board. The current-carrying member penetrates through the dielectric plate and forms a connection with the metal substrate, so that the thickness of the current-carrying member can be increased under the condition that the overall thickness of the circuit board remains unchanged, so that the current-carrying member can pass a large current, and the metal substrate can be better It can meet the heat dissipation requirements of the current-carrying parts and ensure the service life of the circuit board.

Description

technical field [0001] The present application belongs to the technical field of circuit board preparation, and more particularly, relates to an electronic device, a circuit board and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the functions of electronic products are becoming more and more abundant. At the same time, with the increase of various functions, the functional modules, integrated circuits and other electronic devices in electronic products are becoming more and more dense, which requires circuit boards with higher The current carrying capacity is high, so it is a common requirement for the line to pass a large current. [0003] The current carrying capacity of the circuit board mainly depends on the width and thickness of the circuit, that is, the width and thickness of the copper foil. Based on the conventional design of the thickness and width of the copper foil of most circuit boards, the cur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/05H05K3/06H05K3/44
CPCH05K1/0263H05K1/0204H05K1/021H05K1/0296H05K1/056H05K3/06H05K3/44
Inventor 严振坤罗奇王远
Owner KINWONG ELECTRONICS TECH LONGCHUAN