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Rapid method for detecting flatness of high-precision lead frame material for etching

A lead frame and flatness technology is applied in the field of detecting the flatness of high-precision lead frame materials for etching, which can solve the problems of unusable electronic components, inability to predict the flatness of strips, and scrapping of copper strip materials, and improve efficiency. , predicting accurate and improving the effect of accuracy

Active Publication Date: 2021-10-22
中铝洛阳铜加工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If asymmetric dimensional changes such as warping and twisting occur after etching, the copper strip material cannot be used on electronic components and will be scrapped
At present, the prediction of the flatness of high-precision lead frame materials for etching usually adopts direct slitting of copper and copper alloy strips to observe or measure the flatness, but this method cannot predict the flatness of the strip after etching

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] High-precision lead frame material copper tape for IC direction, its technical requirements are:

[0026] Grade: C19400

[0027] Copper strip specification: 0.2×250mm

[0028] Status: H

[0029] Requirements: smooth after etching, warpage ≤ 0.75mm

[0030] The flatness detection process is as follows:

[0031] The first step, sampling: take a copper strip with a length of 260mm and a width of 250mm;

[0032] The second step is to apply the photosensitive adhesive at one time: use a small spray gun to evenly spray the photosensitive adhesive on both sides of the copper strip sample, covering the surface of the copper strip, and there is no leakage of the copper strip;

[0033] The third step, one-time drying: Put the copper strip sample sprayed with photosensitive adhesive into the drying box and heat it to 50°C for drying;

[0034] The fourth step, one-time plate making: use CAD to draw a rectangular pattern with a width of 5mm, and print it on film paper with an i...

Embodiment 2

[0048] The high-precision lead frame material copper tape used in the direction of mobile phones, its technical requirements are:

[0049] Grade: C70250

[0050] Copper strip specification: 0.15×160mm

[0051] Status: H

[0052] Requirements: smooth after etching, warpage ≤ 0.75mm

[0053] The flatness detection process is as follows:

[0054] The first step, sampling: take a copper strip with a length of 180mm and a width of 160mm;

[0055] The second step is to apply the photosensitive adhesive at one time: use a small spray gun to evenly spray the photosensitive adhesive on both sides of the copper strip sample, covering the surface of the copper strip, and there is no leakage of the copper strip;

[0056] The third step, one-time drying: Put the copper strip sample sprayed with photosensitive adhesive into the drying box and heat it to 70°C for drying;

[0057] The fourth step, one-time plate making: use CAD to draw a rectangular pattern with a width of 5mm, and print...

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Abstract

The invention discloses a rapid method for detecting the flatness of a high-precision lead frame material for etching. The technological process comprises the steps of sampling, primary photoresist coating, primary drying, primary plate making, primary exposure, primary development, edge etching, photoresist removing, secondary photoresist coating, secondary drying, secondary plate making, secondary exposure, secondary development, half etching or full etching, flatness measurement and flatness evaluation. According to the method, the problem of pre-judging the flatness of the etched high-precision lead frame material copper strip before the copper strip leaves a factory is solved, the steps of spraying, drying, plate making, etching and the like in the operation process are mainly realized by machines, the influence caused by human factors in the operation process is reduced, the accuracy of etching control is improved, the etching efficiency is greatly improved, and the pre-judgment of the flatness of the etched strip is more accurate, so the method is suitable for quickly pre-judging the flatness of the etched high-precision lead frame material copper strip in mass production.

Description

technical field [0001] The invention belongs to the field of non-ferrous metal smelting and processing, in particular to a fast method for detecting the flatness of high-precision lead frame materials used for etching. Background technique [0002] High-precision lead frame material copper tape is the key material used for frame materials and mobile phone integrated circuit chip carriers. Due to the rapid development of electronic information technology, the technology of miniaturization and integration of key electronic components has been widely used, and subsequent processing is also done by The stamping type is gradually changing to a finer etching method, and the change in the subsequent processing method also puts forward higher requirements for the quality of the high-precision lead frame material copper strip. The flatness of the material after etching is the quality of the high-precision lead frame material copper strip. one of the key evaluation indicators. If asy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F7/16G01B11/30
CPCG03F7/2024G03F7/16G03F7/168G01B11/30
Inventor 郭慧稳丁顺德牛立业万建王梦娜
Owner 中铝洛阳铜加工有限公司
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