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Manufacturing method of PCB with concave step on side surface

The technology of a PCB board and a manufacturing method is applied in the field of manufacturing side concave stepped PCB boards, which can solve problems such as the failure of the PCB board to work normally, and achieve the effects of realizing effective utilization, increasing heat dissipation area, and improving effective combination

Active Publication Date: 2021-10-22
深圳市强达电路股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]With the rapid development of the electronics industry, the technical requirements for printed circuit boards are getting higher and higher, which promotes the continuous development of its design in the direction of high-level and high-density. At the same time of high-level and high-density development, many corresponding problems have also emerged, such as the high concentration of functions, which has also led to the practicality of a large number of connectors. A PCB requires many connectors to connect to different components. Realize the use of corresponding different functions and calculations, but the matching of a large number of connectors makes the periphery of the PCB board bear a large amount of connector weight, and also needs to carry a large number of maintenance problems. Any abnormality of the connector will cause The PCB board cannot work properly, so minimizing the use of connectors is also improving quality and efficiency

Method used

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  • Manufacturing method of PCB with concave step on side surface

Examples

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Comparison scheme
Effect test

Embodiment 1

[0044] A double-sided metal-based 1.6mm PCB board, the thickness of the concave part is 1mm, and a laminated structure is produced according to the requirements. The laminated structure is 0.25mm copper-containing single-sided core board + 0.025mm non-flow glue PP + 1.0mm Metal base + 0.025mm non-flow glue PP + 0.25mm copper-containing single-sided core board. The inner core board 3 is a metal base. After the laminated structure is determined, the circuit of the inner core board 3 is made. Since the inner core board 3 is a metal base substrate, there is no need to make a circuit, and at the same time, the inner core board is not required. 3 production and inner circuit production. According to the typesetting structure, the non-flowing PP sheet is cut, and at the same time, grooves are made on the non-adhesive PP sheet. The groove position is the recessed part of the metal base, and the internal groove of the non-adhesive PP sheet is recessed relative to the metal base. The i...

Embodiment 2

[0048] A four-layer 1.6mm PCB board, the thickness of the concave part is 1mm, and a laminated structure is produced according to the requirements. The laminated structure is 0.25mm copper-containing single-sided core board + 0.035mm non-flowing PP + 1.0mm double-sided FR4 core Board + 0.035mm non-flow glue PP + 0.25mm copper core board. The inner layer core board 3 is a double-sided FR4 core board. After the laminated structure is determined, the inner layer circuit is made. Since the inner layer core board 3 is a single core board, the outer layer circuit is directly one side of the line and one side of the light board layer. Therefore, the production of the inner core board 3 and the production of the outer circuit and the pressing of the cover plate, according to the typesetting structure, cut the non-flowing PP sheet, and at the same time slot the non-adhesive PP sheet, and the slotting position is the inner layer For the recessed part of the core board 3, the inner groov...

Embodiment 3

[0052] A ten-layer PCB board with a thickness of 2.5mm, the thickness of the concave part is 1mm, and the part between the third-layer circuit and the eighth-layer circuit is required to be the inner core board 3 to form a concave part; a laminated structure is produced according to requirements, It is required that the thickness between layers 3-8 is 1mm, that is, one core board for the third layer circuit and the fourth layer circuit, one core board for the fifth layer circuit and the sixth layer circuit, and one core board for the seventh layer circuit and the fourth layer circuit. The eight-layer circuit is a core board, and the three core boards have a symmetrical laminated structure and the thickness of the inner core board 3 is 1 mm. The sum of the thickness between the first layer line and the third layer line and the thickness between the tenth layer line and the eighth layer line is 1.4mm. For symmetrical design, the core between the first layer and the third layer li...

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Abstract

The invention provides a manufacturing method of a PCB with a concave step on the side surface. The PCB comprises an inner layer core board, non-flowing glue PP, an outer layer core board and an auxiliary core board, the laminated structure of the side concave type step PCB comprises the outer layer core board, a PP sheet, the auxiliary core board, a non-flowing glue PP sheet, the inner layer core board, a non-flowing glue PP sheet, the auxiliary core board, a PP sheet and the outer layer core board, the production process of the PCB with the concave side face comprises the steps of 1, determining a laminated structure, 2, manufacturing an inner-layer core board, 3, manufacturing an outer-layer core board and an auxiliary core board, 4, pressing the outer-layer core board and the auxiliary core board to manufacture a cover board, 5, pressing, and 6, carrying out subsequent processes. Compared with the prior art, the beneficial effects are that a specific structure and a specific installation combination mode are realized; the heat dissipation area can be increased while high density and high interconnection can be realized; the protection assembly of part of components and the effective external connection of the inner layer are realized; and effective utilization of the space structure is achieved, and effective combination of the space and the structure is further improved.

Description

technical field [0001] The invention relates to a production and manufacturing process of a PCB board, in particular to a method for manufacturing a side concave stepped PCB board. Background technique [0002] With the rapid development of the electronics industry, the technical requirements for printed circuit boards are getting higher and higher, which promotes the continuous development of its design in the direction of high-level and high-density. While developing at a high level and high density, many corresponding Problems, such as the high concentration of functions, also lead to the practicality of a large number of connectors. A lot of connectors are needed around a PCB, which are connected to different components to realize the use of corresponding different functions and calculations, but a large number of connectors The matching use of the PCB board makes the periphery of the PCB board carry a large amount of connector weight, and also needs to carry a large num...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4697H05K2203/061H05K2201/06
Inventor 万应琪祝小华宋世祥
Owner 深圳市强达电路股份有限公司