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Intelligent power module and manufacturing method thereof

A technology of intelligent power module and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as ignoring packaging methods

Pending Publication Date: 2021-10-26
佛山慧鑫众创科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing technology focuses on solving the problem of wire bonding of intelligent power modules, but ignores how to realize high-efficiency packaging methods of intelligent power modules

Method used

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  • Intelligent power module and manufacturing method thereof
  • Intelligent power module and manufacturing method thereof
  • Intelligent power module and manufacturing method thereof

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Embodiment Construction

[0041] A detailed description will be given below in conjunction with the accompanying drawings.

[0042] Aiming at the cumbersome process of curing the photosensitive glue in the packaging process of the intelligent power module in the prior art, the present invention improves the structure of the light-transmitting component and the injection method of the photosensitive glue, so that the photosensitive glue can be cured faster and can be combined with the light-transmitting The components are removed in a connected manner, which reduces the retention probability of the photosensitive adhesive, optimizes the packaging method of the intelligent power module, improves the packaging speed, and then improves the packaging efficiency.

[0043] The substrate in the present invention is a printed circuit board, a ceramic substrate or a semiconductor interposer, wherein appropriate circuits and / or plated through holes (not shown) are provided in the substrate to electrically connect ...

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Abstract

The invention relates to an intelligent power module and a manufacturing method thereof, the intelligent power module comprises a substrate provided with a solder mask layer, a sealing compound and a chip provided with a metal column, the sealing compound is arranged on the substrate in a mode of being in contact with the solder mask layer, and a plurality of cavities formed based on the contour shape of a light-transmitting assembly are arranged in the sealing compound. A metal column consistent with the light-transmitting assembly in outline shape is inserted into the cavity in the mode that soldering paste at the end of the metal column makes contact with a connecting pad in the cavity, a photosensitive cavity communicated with a glue injection channel is formed in the light-transmitting assembly, and the glue injection channel is formed in one end of the light-transmitting body in the mode of being communicated with the outside. And the photosensitive cavity is arranged at the other end of the light-transmitting main body in a manner that the contact area with the outside is not less than 50% of the cross sectional area of the light-transmitting main body. The plurality of light guide grooves, the glue injection channel and the photosensitive cavity are arranged in the light-transmitting body, so that the photosensitive cavity can be connected with the light-transmitting body and removed at the same time after being cured, the retaining probability of the photosensitive glue is reduced, and the packaging efficiency of the intelligent power module is improved.

Description

technical field [0001] The invention relates to the technical field of intelligent power module packaging, in particular to an intelligent power module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module (IPM) is the abbreviation of Intelligent Power Module, which is an advanced power switching device with the advantages of GTR (high power transistor) high current density, low saturation voltage and high voltage resistance, and MOSFET (field effect transistor) high Advantages of input impedance, high switching frequency and low drive power. Moreover, IPM integrates logic, control, detection and protection circuits inside, which is convenient to use, not only reduces the size of the system and development time, but also greatly enhances the reliability of the system, adapting to the development direction of today's power devices - modularization , composite and power integrated circuits (PICs), have been more and more widely used in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768
CPCH01L21/76816H01L21/76897
Inventor 杨国宇何燕君李铭锋
Owner 佛山慧鑫众创科技有限公司
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