Semiconductor device, preparation method thereof and communication equipment

Abstract

The invention provides a semiconductor device, a preparation method thereof and communication equipment. The semiconductor device comprises a semiconductor substrate, a photoelectric device and a conducting piece. The photoelectric device and the conducting piece are arranged on the semiconductor substrate, the photoelectric device and the conducting piece are coupled and aligned, a mounting surface of the semiconductor substrate is provided with at least three limiting supporting columns, and the at least three limiting supporting columns define at least one triangular area. The photoelectric device comprises limiting grooves in one-to-one correspondence with the limiting supporting columns, the ends, away from the mounting face, of the limiting supporting columns are contained in the limiting grooves, and the photoelectric device is supported and limited by making contact with the inner walls of the limiting grooves. The semiconductor device is used for avoiding the problem that the coupling alignment precision of the welded active chip and the passive device is poor due to the fact that the active chip can generate displacement under high-temperature welding.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a semiconductor device, a manufacturing method thereof, and a communication device. Background technique [0002] In the hybrid integration technology of optoelectronics and silicon photonics, active chips (such as lasers, amplifiers, etc.) are attached to the silicon optical bench (Silicon Optical Bench, SiOB) through flip-chip bonding, and are welded to the silicon base. Instead, the optical path is coupled from the active chip to the waveguide on the silicon-based bench. After the active chip is flip-chip bonded to the silicon-based optical bench, the alignment accuracy of the coupling alignment with the passive device determines the optical loss of the packaged device. The current bonding accuracy mainly depends on the mechanical accuracy of the bonding equipment. At present, the placement accuracy of high-precision equipment is best at 0.5 micron level, bu...

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Problems solved by technology

[0003] This application provides a semiconductor device, which is used to ensure the welding accuracy of the active chip during high temperature welding, and to avoid the displacement of the active chip under high temperature welding, resulting in the coupling alignment of the active chip and the passive device after welding The problem of poor precision

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