Non-curable thermally conductive silicone composition

Abstract

The present invention is a non-curable thermally conductive silicone composition characterized by containing as essential components (A) 5-20 mass% relative to the total of component (A) and component (B) of an organopolysiloxane having a kinematic viscosity at 25 DEG C of 1,000,000 mm<2> / s or higher, (B) 80-95 mass% relative to the total of component (A) and component (B) of a hydrolyzable organopolysiloxane compound represented by general formula (1), and (C) a thermally conductive filler in an amount to make 10-95 mass% relative to the entire composition, and by the molecular weight distribution Mw / Mn of a mixture of component (A) and component (B) being 10 or higher. Thereby provided is a non-curable thermally conductive silicone composition having excellent application workability and good pumping-out resistance by maintaining an appropriate viscosity while containing a large amount of thermally conductive filler. (In the formula, R1 represents an optionally substituted C1-10 monovalent hydrocarbon group and m is an integer of 5-100).

Description

technical field [0001] The invention relates to a non-curable thermally conductive silicone composition. Background technique [0002] It is well known that electronic devices such as large scale integrated circuits (LSI) and integrated circuit (IC) chips generate heat during use and the resulting degradation in performance, and various heat dissipation techniques are used as means for solving this problem. As a general heat radiation technique, a cooling member is disposed near a heat generating part and the two are brought into close contact, and heat is effectively removed through the cooling member to dissipate heat. [0003] At this time, if there is a gap between the heat-generating member and the cooling member, air with poor thermal conductivity will exist, thereby reducing the thermal conductivity, and the temperature of the heat-generating member cannot be sufficiently lowered. In order to prevent the existence of such air and improve thermal conductivity, a heat ...

AI Technical Summary

Problems solved by technology

Condensation-curable thermal paste has the advantage that it can undergo a curing reaction without a heating process as long as a certain amount of moisture is present. However, since a low-boiling detachment component is generated during the curing reaction, it is affected by odor and detachment components in electronic devices. Pollution, etc. left major technical problems

[0009] On the other hand, the advantage of "non-curing" thermal paste is that it is easy to handle, and generally can be transported and stored at room temperature, but there is a technical problem that the above-mentioned extraction is easy to occur

For "non-curing type" thermal paste, it is effective to increase the viscosity of the paste as a means to reduce draw-out, but conversely, it becomes a technical problem that the coating workability decreases.

[0010] As mentioned above, although it is preferable to use "cured" thermal paste in order to improve the reliability of semiconductor packages, it is difficult to call it the best in terms of strict temperature control, complicated curing procedures, and environmental burdens.

[0011] On the other hand, "non-curing type" thermal paste is easy to handle and has a small environmental burden, but it is easy to draw out, and in order to ensure the reliability of semiconductor packaging, it is necessary to increase the viscosity.

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