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OLED packaging method and OLED packaging structure

A packaging method and packaging structure technology, applied in semiconductor devices, electrical components, photovoltaic power generation, etc., can solve problems such as reducing the barrier effect, and achieve the effect of improving the barrier performance, increasing the water and oxygen barrier, and improving the bonding.

Active Publication Date: 2021-11-05
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high water and oxygen sensitivity of OLED materials, factors such as improper selection of adhesive materials, unevenness of glue application, and uneven film thickness of thin-film packaging will affect the life of the device in different ways and reduce the barrier Effect

Method used

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  • OLED packaging method and OLED packaging structure
  • OLED packaging method and OLED packaging structure
  • OLED packaging method and OLED packaging structure

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Embodiment Construction

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0037] The present application provides a packaging method for OLEDs. After coating a plurality of filling glue (fill glue) on the packaging cover plate, depositing the organic silicon precursor, the organic silicon precursor is treated with fluorine-containing plasma gas, thereby A fluorine-containing organic thin film layer is formed on the packaging cover plate between multiple filling glues, and fluorine ions are gathered on the surfaces of the multiple filling glues. Due to...

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Abstract

The invention provides a packaging method of an OLED and an OLED packaging structure. The OLED packaging method comprises the following steps: providing an OLED substrate and a packaging cover plate; coating a plurality of filling adhesives on the packaging cover plate; depositing an organic silicon precursor on the upper surface of the packaging cover plate among the plurality of filling adhesives in vacuum; introducing fluorine plasma treatment gas into the organic silicon precursor to form a fluorine-containing organic film; and oppositely attaching the packaging cover plate to the OLED substrate by using a packaging adhesive.

Description

technical field [0001] The present application relates to the field of display technology, in particular to an organic light emitting diode (OLED) packaging method and an organic light emitting diode (OLED) packaging structure. Background technique [0002] At present, organic light-emitting diode (OLED) flexible displays are flexible, thin, and self-luminous, and more and more products are born. At present, more and more structures are carried out in the form of thin-film packaging, but because the thin-film packaging film layer is thin and there is stress between the film layers, the ability to block water and oxygen has not yet achieved the desired effect. In order to enhance the packaging effect At present, the OLED flexible display is packaged and strengthened by cover plate packaging, and UV frame glue and desiccant are added to further isolate water vapor. [0003] The packaging method of the existing OLED flexible display is usually as follows figure 1 As shown, by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/00H10K50/84H10K71/00Y02E10/549
Inventor 黄辉
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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