A vacuum coating method for a vacuum coating machine

Abstract

The invention discloses a vacuum coating method for a vacuum coating machine, comprising the following steps: S1, preliminary preparation of equipment: S11, providing a vacuum coating machine; S12, sealing a valve disc and a valve seat to establish a vacuum for a cold pump; S13, The substrate and the target are placed; S2 roughly vacuumizes the coating chamber, and the cold pump continues to vacuum; S3, the rough vacuum is completed; S4, the valve disc is separated from the valve seat, and the cold pump is used to continue to establish the coating chamber again. Vacuum; S5, valve disc and valve seat seal; S6, start the evaporation program; S7, stop working; S8, break the air; S9, take the substrate out of the coating chamber; S10, repeat the steps after replacing a new batch of substrates S2 to S9. The vacuum coating method can reduce the time for forming a vacuum environment and improve the efficiency of vacuum coating.

Description

technical field [0001] The invention relates to a vacuum coating method of a vacuum coating machine, and belongs to the technical field of vacuum coating by electron beams. Background technique [0002] Vacuum coating machine is a kind of equipment to realize the vacuum coating method in the process of semiconductor material production. At present, the electron beam evaporation method is mainly used. A method in which the sheet moves and condenses to form a thin film on the substrate. The electron beam evaporation deposition method can prepare high-purity thin films. At the same time, multiple crucibles can be placed in the same evaporation deposition device to achieve simultaneous or separate evaporation and deposition of various substances. With electron beam evaporation, any material can be evaporated. Electron beam evaporation can evaporate materials with high melting point. It has high evaporation heat efficiency, high beam current density, and fast evaporation speed....

AI Technical Summary

Problems solved by technology

[0005] 1. In the current vacuum coating method, the evaporation process chamber uses a cold pump to provide vacuum, and the efficiency is relatively low. Since the substrates in the chamber are coated in batches, after the coating is completed, the chamber needs to be opened to take out the substrates. Therefore, the entire The process chamber will become a normal pressure state, and then a cold pump is required to continuously provide vacuum. Therefore, in order to prepare more substrates at a time, the volume of the process chamber is set to be relatively large, so that the time for vacuum generation is very long. It seems that Many substrates can be coated at one time, but the time interval is long, resulting in low overall efficiency;

[0006] 2. In the current vacuum coating method, after vacuum coating, the inner wall of the cavity will also be coated with a metal film layer, and the inside of the process cavity is difficult to clean;

[0007] 3. In the current vacuum coating method, the process chamber is connected to the cold pump through a cold pump suction pipe, and the gas in the process chamber needs to gradually flow to the cold plate side of the cold pump, and due to the temperature of the cold plate of the cold pump Very low, so as to ensure that the gas inside the chamber is liquefied, and the temperature in the process chamber is lowered when the temperature is lower, and because the condensation temperature of water vapor is high, this may cause some moisture in the process chamber to not completely move It has already condensed on the cold plate, so that the condensed liquid droplets will adhere to some hidden corners in the process chamber and will not be sucked away, so that when the electron beam is evaporated, the water will vaporize to form water vapor, and the water vapor will follow The metal vapor rises together, directly affecting the thickness and fastness of the vacuum coating on the substrate;

[0008] 4. In the current vacuum coating method, there are two ways to rotate the substrate, one is to revolve with the revolution frame, and the revolution frame itself rotates at the same time, the other is only one rotation frame, and the rotation frame is located on the top of the process chamber. When the rotation mode is used to rotate, because the metal vapor escapes upward, the linear speed of the substrate at the rotation center and the peripheral substrate is not the same, resulting in fluctuations in the thickness difference of a batch of substrate coatings.

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