A semiconductor packaging mold
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 南通迅腾精密设备有限公司
- Publication Date
- 2021-12-10
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor packaging mold. Background technique
[0002] Semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement. For example, diodes are devices made of semiconductors. Control, ranging from materials between insulators to conductors, whether from the perspective of technology or economic development, the importance of semiconductors is huge, most of today's electronic products, such as computers, mobile phones or digital The core units in the tape recorder are closely related to semiconductors. Common semiconductor materials include silicon, germanium, arsenide, etc., and among various semiconductor materials, silicon is the most influential in commercial applications. When the semiconductor is produced and leaves the ...