A semiconductor packaging mold

Abstract

The invention discloses a semiconductor packaging mold, which relates to the technical field of semiconductors, and comprises a mounting base and a concave support frame fixedly installed on the top surface of the mounting base. A driving component is fixedly installed on the top surface of the middle part of the concave support frame, and the output of the driving component is The screw screw assembly is fixedly installed at the end, and the screw screw assembly is arranged at the lower end of the middle part of the concave support frame. When the operator needs to package the packaging box containing the semiconductor, first place the packaging box in the concave bar, then By placing the screw in the circular placement hole, the electric cylinder is started at this time, and the screw head drives the screw to rotate for packaging work. This setting can not only quickly screw and tighten multiple screws, but also improves the packaging efficiency. At the same time, it cleverly uses the downward displacement of the output end of the electric cylinder, which is easy to use.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor packaging mold. Background technique [0002] Semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement. For example, diodes are devices made of semiconductors. Control, ranging from materials between insulators to conductors, whether from the perspective of technology or economic development, the importance of semiconductors is huge, most of today's electronic products, such as computers, mobile phones or digital The core units in the tape recorder are closely related to semiconductors. Common semiconductor materials include silicon, germanium, arsenide, etc., and among various semiconductor materials, silicon is the most influential in commercial applications. When the semiconductor is produced and leaves the ...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a semiconductor packaging mold, which works by using this device, so as to solve the problem of packaging semiconductors in the above background, usually stacking semiconductors in a packaging box, and then fixing the packaging box cover on the package. On the box, by setting screws on the four corners of the package box cover, a stable package of the semiconductor can be achieved, but this packaging method requires the operator to screw and fix the screws on the four corners of the package box cover one by one, not only need to use a screwdriver, but also It also consumes manpower, greatly reduces the packaging efficiency, and is not easy to use

Images