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Preparation method of MgB2 superconducting microbridge

A micro-bridge and superconducting technology, which is applied in the field of preparation of MgB2 superconducting micro-bridges, can solve the problems of destroying the superconducting properties of thin-film micro-bridges, micro-bridge quenching, and affecting the performance of HEB devices.

Pending Publication Date: 2021-11-09
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0005] Current MgB 2 The preparation of superconducting microbridges is realized in the order of first growing superconducting thin films, and then microfabrication of the thin films. Since the microfabrication process involves surface treatment, exposure or etching of the thin films, it will cause irreversible damage to the thin films. , destroy the superconducting properties of thin film microbridges and even quench the microbridges, seriously affecting the device performance of HEB

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  • Preparation method of MgB2 superconducting microbridge
  • Preparation method of MgB2 superconducting microbridge
  • Preparation method of MgB2 superconducting microbridge

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preparation example Construction

[0029] The invention provides a MgB 2 A method for preparing a superconducting microbridge, comprising the following steps:

[0030] A microbridge structure is prepared by direct writing on a bare substrate using a focused ion beam; the size of the microbridge structure is comparable to that of MgB 2 The dimensions of the superconducting microbridges are the same;

[0031] Depositing MgB on the surface of the microbridge structure using a mixture of physical and chemical vapor deposition 2 superconducting thin film, forming MgB 2 superconducting microbridge.

[0032] The invention adopts the focused ion beam to write directly on the bare substrate to prepare the micro bridge structure.

[0033] Before preparing the micro-bridge structure, the present invention preferably designs the structure and size of the micro-bridge according to actual requirements, and then uses focused ion beams to process on the bare substrate. The present invention preferably designs the microbri...

Embodiment 1

[0045] (1) The size of the microbridge is designed to be 0.5μm×1μm, that is, the length of the microbridge is 1μm and the width is 0.5μm;

[0046] (2) Put the clean 5*5mm 2 Put the SiC substrate into the FIB / SEM dual-beam system, set the ion beam accelerating voltage to 30kV, and the beam current to 70pA. After focusing, etch a microbridge of 0.5μm×1μm on the SiC substrate;

[0047] (3) Open the reaction chamber, place 6 cut Mg blocks (each with a mass of about 2 to 4 g and a purity of not less than 99.99%) evenly on the sample stage, and etch a microbridge in step (2) The SiC substrate is placed in the center of the sample stage;

[0048] (4) Close the reaction chamber, turn on the mechanical pump to extract the vacuum of the reaction chamber, and when the vacuum is less than 7Pa, H 2 ;

[0049] (5) When the degree of vacuum (or background pressure) becomes about 4.17kPa, heat the sample stage;

[0050] (6) When the temperature reaches 665°C, feed diborane with a flow ra...

Embodiment 2

[0054] (1) The size of the microbridge is designed to be 0.5μm×2μm, that is, the length of the microbridge is 2μm and the width is 0.5μm;

[0055] (2) Put the clean 5*5mm 2 Put the SiC substrate into the FIB / SEM dual-beam system, set the ion beam accelerating voltage to 30kV, and the beam current to 150pA, and etch a microbridge of 0.5μm×2μm on the SiC substrate after focusing;

[0056] (3) Open the reaction chamber, place 6 cut Mg blocks (each with a mass of about 2 to 4 g, and a purity of not less than 99.99%) evenly on the sample stage, and etch a microbridge in step (2) The SiC substrate is placed in the center of the sample stage;

[0057] (4) Close the reaction chamber, turn on the mechanical pump to extract the vacuum of the reaction chamber, and when the vacuum is less than 7Pa, H 2 ;

[0058] (5) When the degree of vacuum (or background pressure) becomes 4.17kPa, heat the sample stage;

[0059] (6) When the temperature reaches 640°C, feed diborane with a flow rat...

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Abstract

The invention provides a preparation method of an MgB2 superconducting microbridge, and belongs to the technical field of superconducting microbridge preparation. The preparation method of the MgB2 superconducting microbridge comprises the steps of preparing a microbridge structure on a bare substrate by adopting a focused ion beam through direct writing, wherein the size of the microbridge structure is the same as that of the MgB2 superconducting microbridge; and depositing an MgB2 superconducting thin film on the surface of the microbridge structure by adopting mixed physical chemical vapor deposition to form the MgB2 superconducting microbridge. According to the invention, the microbridge structure is prepared firstly, and then the MgB2 superconducting thin film is deposited, so that the superconducting thin film can be effectively prevented from being damaged, and the performance of the superconducting microbridge is ensured.

Description

technical field [0001] The invention relates to the technical field of preparation of superconducting microbridges, in particular to a MgB 2 Preparation method of superconducting microbridge. Background technique [0002] The terahertz band (the universal division standard is 0.1-10THz frequency band, corresponding to a wavelength of 3mm-30 microns) has important scientific significance and rich application prospects, and plays an important role in radio astronomy and atmospheric physics, especially in the study of the ozone layer , It also has good application potential in the aspects of biological non-destructive testing and future wireless networks. [0003] Currently common terahertz detectors mainly include coherent detection and incoherent detection. Coherent detection can detect the amplitude and phase of the measurement field, while non-coherent detection can only detect the amplitude of the field. Compared with incoherent detection, coherent detection has higher s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L39/24H10N60/01
CPCH10N60/0856
Inventor 孔祥东张新月李艳丽韩立
Owner INST OF ELECTRICAL ENG CHINESE ACAD OF SCI