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Wafer leveling method, chip bonding method, chip bonding equipment and photoetching system

A chip bonding and leveling technology, applied in the field of photolithography, can solve the problems of rapid adjustment of wafer surface flatness, troublesome operation, high cost, etc., and achieve the effect of reducing chip bonding cost, low cost and improving quality

Active Publication Date: 2021-12-03
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing method of adjusting the perpendicularity between the bonding head and the wafer surface is cumbersome to operate, with high cost and low efficiency, and it is difficult to quickly adjust the flatness of the wafer surface.

Method used

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  • Wafer leveling method, chip bonding method, chip bonding equipment and photoetching system
  • Wafer leveling method, chip bonding method, chip bonding equipment and photoetching system
  • Wafer leveling method, chip bonding method, chip bonding equipment and photoetching system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] figure 1 Schematic diagram of the structure of the chip bonding equipment provided by the embodiment of the present invention, such as figure 1 As shown, this embodiment provides a chip bonding device, which is applied in a photolithography system, and is used to realize the bonding between the chip 5 and the wafer 13 , so as to realize the integrated arrangement of the chip 5 . The chip bonding equipment includes a wafer table 11 , a chuck 12 arranged on the wafer table 11 , a wafer 13 adsorbed on the upper surface of the chuck 12 , and a bonding head assembly 4 for picking up the chip 5 for bonding.

[0056] A bonding glue 14 is provided on the upper surface of the wafer 13. During the bonding process of the chip 5 and the wafer 13, the bonding head 41 picks up the chip 5 and drives the chip 5 to move down to the bonding position, and passes the chip 5 through the bonding glue. 14 is attached to the wafer 13. The bonding adhesive 14 is melted at a certain temperatur...

Embodiment 2

[0098] Affected by the quality of the incoming material of the wafer 13, when the overall flatness of the upper surface of the wafer 13 is good, the entire surface of the wafer 13 can be used as a leveling area 132 for leveling treatment. When it is relatively large, it is necessary to divide the upper surface of the wafer 13 into several leveling areas 132 for leveling in sequence to ensure the high consistency of bonding between the chip 5 and the wafer 13 in each leveling area 132 .

[0099] thus, Figure 6 is a flow chart of the leveling method provided by the embodiment of the present invention, such as Figure 6 As shown, this embodiment provides a wafer leveling method, which can determine whether to choose global leveling or regional leveling through detection, thereby improving the leveling effect. Specifically, the leveling method provided in this embodiment includes the following steps:

[0100] Step S201: Determine the detection coordinate system;

[0101] In th...

Embodiment 3

[0118] This embodiment provides a chip bonding method, which uses the wafer leveling method in Embodiment 1 or Embodiment 2 to carry out wafer 13 leveling before chip 5 bonding, to improve chip 5 and wafer 13 The quality of the bond.

[0119] Such as Figure 8 As shown, the chip bonding method provided in this embodiment mainly includes the following steps:

[0120] Step S301: Leveling the current leveling area 132, after the current leveling area 132 is leveled, execute step S302;

[0121] Using the wafer leveling method in step S101-step S108 in the first embodiment to level the wafer 13;

[0122] Step S302: the bonding head 41 absorbs the chips 5 to be bonded in the current leveling area 132 and bonds them to the current leveling area 132;

[0123] Step S303: judge whether all chips 5 to be bonded in the current leveling area 132 are bonded, if not, return to step S302, and if so, execute step S304;

[0124] When there are several leveling areas 132, after each leveling...

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PUM

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Abstract

The invention belongs to the technical field of photoetching, and particularly discloses a wafer leveling method, a chip bonding method, chip bonding equipment and a photoetching system. The wafer leveling method comprises the following steps: selecting a leveling detection point in a leveling area; for each leveling detection point, obtaining X and Y coordinates of the leveling detection point, in the process that the bonding head approaches the leveling detection point in the Z coordinate direction, detecting the flow change in the bonding head in real time, and obtaining the Z coordinate of the leveling detection point; conducting fitting to obtain a fitting leveling plane, and solving the overall gradient of the leveling area; and adjusting a wafer table. According to the chip leveling method, before chip bonding, a wafer is leveled by adopting the wafer leveling method; and the chip bonding equipment adopts a chip bonding method to carry out bonding, and the photoetching system comprises the chip bonding equipment. According to the wafer leveling method, the chip bonding method, the chip bonding equipment and the photoetching system provided by the invention, the bonding quality of the chip and the wafer can be improved, and the bonding height consistency of the chip is improved.

Description

technical field [0001] The invention relates to the technical field of photolithography, in particular to a wafer leveling method, a chip bonding method, chip bonding equipment and a photolithography system. Background technique [0002] Chip-to-wafer (C2W) bonding technology is one of the key technologies for the development and practical application of MEMS technology, which can bond multiple chips on the entire wafer through chemical and physical actions to prepare and form High-level and small-sized microcontrollers, micro-sensors, etc. [0003] The chip bonding equipment provided in the prior art usually adopts a bonding head to vertically absorb the chip to be bonded and then transfer it to the top of the wafer, so that the chip and the wafer are bonded into one body through a bonding glue. After the chip bonding is completed, photolithography needs to be performed again to produce other graphics. Since the depth of focus of the lithography machine is generally limit...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/66
CPCH01L21/67259H01L21/67144H01L22/26
Inventor 陈飞彪朱鸷
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD