Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

BGA ball mounting device and method based on SMT reworking table

A rework station and ball-planting technology, which is applied in the direction of assembling printed circuits, printed circuits, and electrical components with electrical components, can solve the problems of easy interference, poor positioning accuracy, and difficulty in placing solder balls, and achieves good versatility. , the effect of orderly placement

Active Publication Date: 2021-12-07
SHANGHAI RADIO EQUIP RES INST
View PDF10 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a BGA ball planting device and method based on an SMT rework station to solve the problems of difficult solder ball placement, poor positioning accuracy, and susceptibility to interference, and has high accuracy, strong versatility, and stability high sex advantage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • BGA ball mounting device and method based on SMT reworking table
  • BGA ball mounting device and method based on SMT reworking table
  • BGA ball mounting device and method based on SMT reworking table

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] Below will combine the appended in the embodiment of the present invention figure 1 ~ attached Figure 9 , to describe in detail the technical solutions, structural features, achieved goals and effects in the embodiments of the present invention.

[0047] It should be noted that the drawings are in a very simplified form and all use inaccurate proportions, which are only used to facilitate and clearly illustrate the purpose of the implementation of the present invention, and are not used to limit the limiting conditions for the implementation of the present invention, so they do not have technical In the substantive meaning above, any modification of structure, change of proportional relationship or adjustment of size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and goals that can be achieved by the present invention. within the scope covered.

[0048] It should be noted that, in the pres...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a BGA ball mounting device based on an SMT (surface mount technology) reworking table, which comprises a soldering paste printing tool, used for printing a soldering paste array on a bonding pad of a BGA device; a ball mounting tool, used for placing solder balls and comprising a ball leakage steel sheet, holes being formed in the ball leakage steel sheet in an array mode, and the positions of the holes corresponding to solder paste printed on a BGA device bonding pad; a limiting frame, used for fixing the ball leaking steel sheet; a ball carrying main body, nested in the limiting frame, positioned below the ball leaking steel sheet and used for receiving the solder balls falling from the holes of the ball leaking steel sheet; and a SMT reworking table, used for pasting the to-be-reballed BGA devices printed with the soldering paste to the solder balls placed by the reballing tool in a one-to-one correspondence manner through visual alignment. The BGA ball mounting method comprises the steps of solder paste printing, solder ball placement, solder ball and solder paste positioning and reflow soldering. The device has the advantages of high accuracy, high universality and high stability.

Description

technical field [0001] The invention relates to the field of BGA assembly rework, in particular to a BGA ball planting device and method based on an SMT rework station. Background technique [0002] With the development of large-scale integrated circuits and ultra-large-scale integrated circuits, the trend of miniaturization of products is becoming more and more obvious, and ball grid array packaging components (BGA) have emerged at the historic moment. It has small package volume, large number of pins, and good electrical performance. Features. In packaging batch production, the ball planting of BGA devices is realized through special ball planting equipment, which requires customized tooling and fixtures. This method has the characteristics of high production cost, complicated parameter adjustment, and high requirements for personnel, and is suitable for large-scale production. . In the SMT (Surface Mounted Technology, surface mount technology) production line, most of t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K13/00H05K3/34
CPCH05K13/0061H05K13/0409H05K13/0465H05K3/341H05K2201/09836Y02P70/50
Inventor 魏庆晶吴朗章恺杨鑫鑫季磊潘沁梦林俊贤杨晓萍
Owner SHANGHAI RADIO EQUIP RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com