Room-temperature electro-deposition preparation method of copper foil with high crystal face preferred orientation

A technology of preferred orientation and crystal plane orientation, applied in electroforming, electrolytic process, electrolytic components, etc., can solve the problems of reducing the conductivity of copper foil, impairing grain growth, impairing mechanical properties, etc., achieving simple formula, easy operation, simple method effect

Inactive Publication Date: 2021-12-17
NANKAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Common commercial lithium battery copper foil is mostly electrolytic copper foil, and the production process is simple and mature. However, various additives are used in the preparation process of electrolytic copper foil, such as brighteners, leveling agents, and surfactants. The use of these additives will reduce the copper foil. electrical conductivity and introduce impurities that may impair grain growth and thus its mechanical properties
And the commercial electrolytic copper foil is polycrystalline copper foil, and the many grain boundaries contained inside will also damage its electrical and mechanical properties

Method used

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  • Room-temperature electro-deposition preparation method of copper foil with high crystal face preferred orientation
  • Room-temperature electro-deposition preparation method of copper foil with high crystal face preferred orientation
  • Room-temperature electro-deposition preparation method of copper foil with high crystal face preferred orientation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A copper foil with preferred crystal plane orientation, the preferred crystal plane is copper (111) plane. Prepared by pulse current deposition method, such as figure 1 As shown, the steps are as follows:

[0030] Step 1): weighing a certain mass of copper sulfate pentahydrate with a purity of 98%, adding a certain mass of deionized water, fully stirring and heating to completely dissolve it, and preparing a 250g / L copper sulfate solution. Draw a small amount of concentrated sulfuric acid 0.9-1.1.

[0031] Step 2): Take 50-100mL of the above-mentioned copper sulfate solution, wash the copper sheet with a size of 2*2cm and a purity of 99.99% with dilute sulfuric acid, deionized water, and absolute ethanol, and wash the copper sheet with a size of 1*1.5cm and a purity of 99% The titanium sheet is submerged in absolute ethanol for 5 minutes, and the copper sheet and titanium sheet are composed of an anode and a cathode, and immersed in the above-mentioned copper sulfate ...

Embodiment 2

[0034] A copper foil with preferred crystal plane orientation, the preferred crystal plane is copper (111) plane.

[0035] Compared with Example 1, the difference in the preparation steps is that only the deposition resting time is changed to 20 ms, step 3) obtains copper foil Q2 with preferred orientation of copper (111) crystal plane, and its orientation is stronger than that of copper foil Q1. The XRD pattern of copper foil Q2 matte surface is as follows image 3 shown.

Embodiment 3

[0037] A copper foil with no crystal face preferred orientation.

[0038] Compared with Example 1, the difference in the preparation steps is that only the deposition resting time is changed to 60 ms, step 3) obtains the copper foil Q3 without the preferred orientation of the crystal plane. The XRD pattern of copper foil Q3 matte surface is as follows Figure 4 shown.

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Abstract

The invention discloses a room-temperature electro-deposition preparation method of a copper foil with high crystal face preferred orientation. The method comprises the following steps of (1) dissolving copper sulfate pentahydrate with deionized water, and adding a small amount of concentrated sulfuric acid to prepare an electrolyte with the pH value of 0.9-1.1 and the copper sulfate content of 240-260 g / L; (2) applying pulse current for electro-deposition by serving a copper sheet as an anode and a titanium sheet as a cathode, wherein the electro-deposition parameter ranges are as follows: the deposition current density is 0.5 A / cm<2>, the deposition time is 50 ms, the deposition standing time is 0-500 ms, the oxidation current density is 0.05 A / cm<2>, the oxidation time is 20 ms, and the oxidation standing time is 20 ms; and (3) taking out the cathode, and alternately cleaning with dilute sulphuric acid and deionized water to obtain the copper foil with high crystal face preferred orientation. The method is rapid and easy to amplify, no additive is contained, and the prepared electrolytic copper foil has high copper (111) and copper (220) crystal face preferred orientation and has excellent electronic conductivity.

Description

technical field [0001] The invention belongs to the technical field of electronic materials and metal materials, and in particular relates to a rapid preparation method of room temperature electrodeposition of copper foil with high crystal plane preferred orientation. Background technique [0002] Electrolytic copper foil is one of the important basic materials in the electronics industry and is widely used in the electronics industry. With the rapid development of electric vehicles, the demand for lithium batteries is increasing rapidly. Copper foil is the main material of the negative electrode collector of lithium batteries, and its performance plays an extremely important role in the performance of lithium batteries. Common commercial lithium battery copper foil is mostly electrolytic copper foil, and the production process is simple and mature. However, various additives are needed in the preparation process of electrolytic copper foil, such as brighteners, leveling age...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04C25D3/38C25D21/12
CPCC25D1/04C25D3/38C25D21/12
Inventor 严振华罗中跃陈军程方益李海霞
Owner NANKAI UNIV
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