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Bidirectional telescopic probe

A probe and tail section technology, applied in the field of probes, can solve problems such as easily lost parts, and achieve the effects of compact connection, extended service life, easy wiping and lubrication

Active Publication Date: 2022-07-01
南通芯盟测试研究院运营管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The parts of the probe are loosely connected, easy to lose parts

Method used

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  • Bidirectional telescopic probe
  • Bidirectional telescopic probe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] like figure 1 The two-way telescopic probe shown has a mandrel, a spring and a sleeve. The mandrel is composed of a tail section, a middle section and a tip section. The outer part of the middle section is sleeved with the spring, and the outer part of the middle section and the tip section is sleeved with a sleeve; the tail section is a section. Larger diameter studs with external threads have a central diameter in the middle and a tapered diameter in the tip.

[0026] The sleeve has a hollow structure connecting two sections, the inner diameter of the section close to the tail section is larger than the outer diameter of the spring, and the inner diameter of the section close to the tip is larger than the diameter of the middle section and smaller than the outer diameter of the spring.

[0027] The inner side wall surface near the end section has an inner thread, and the inner thread can form a matching relationship with the outer thread of the stud, and the spring is...

Embodiment 2

[0030] like figure 2 The two-way telescopic probe shown has a mandrel, a spring and a sleeve. The mandrel is composed of a tail section, a middle section and a tip section. The outer part of the middle section is sleeved with the spring, and the outer part of the middle section and the tip section is sleeved with a sleeve; the tail section is a section. Larger diameter studs with external threads have a central diameter in the middle and a tapered diameter in the tip.

[0031] The sleeve has a hollow structure connecting two sections, the inner diameter of the section close to the tail section is larger than the outer diameter of the spring, and the inner diameter of the section close to the tip is larger than the diameter of the middle section and smaller than the outer diameter of the spring.

[0032] The inner side wall surface near the end section has an inner thread, and the inner thread is screwed together with the outer thread of the stud.

[0033] There is also a nut...

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PUM

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Abstract

The invention provides a bidirectional telescopic probe, which is provided with a mandrel, a spring and a sleeve. The mandrel is composed of a tail section, a middle section and a pointed section, the outer periphery of the middle section is sleeved with a spring, and the outer periphery of the middle section and the pointed section is also sleeved with a sleeve Tube. The casing is a hollow structure, the inner diameter of the section close to the tail section is larger than the outer diameter of the spring, and the inner diameter of the section close to the tip is larger than the diameter of the middle section; the inner wall surface of the tail section has an internal thread, which forms a matching relationship with the external thread of the stud. The sleeve of the present invention is screwed on the stud, so that the sleeve, the spring and the nut will not fall off and be lost, thereby prolonging the service cycle of the thimble.

Description

technical field [0001] The invention relates to a probe used in the chip testing industry. Background technique [0002] The probe is the contact medium for electrical testing and is a high-end precision electronic hardware component. The probes are usually installed on the probe card. The probes on the probe card are directly contacted with the pads or bumps on the chip to draw out the chip signal, and then cooperate with the peripheral testing instruments and software control to achieve the purpose of automatic measurement. The probe is used before the IC is packaged, and the function test is performed on the bare die, and the defective products are screened out, and then the subsequent packaging project is carried out. [0003] The patent with the application number of 2013200801640 discloses a semiconductor test probe for conducting a circuit board to be tested and a test circuit board in a test device, which comprises: a conductive rod body, the two ends are respective...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/067
CPCG01R1/06722
Inventor 朱元庆袁宇锋戴莉王建镖
Owner 南通芯盟测试研究院运营管理有限公司
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