Wafer clamping mechanism and wafer post-processing equipment

Abstract

The invention discloses a wafer clamping mechanism and wafer post-processing equipment. The wafer clamping mechanism comprises a rotatable base of a disc-shaped structure, clamping jaws used for holding wafers are arranged on the peripheral side of the base at intervals, the clamping jaws are provided with an end face which is seen directly facing the wafer, a first side face which is in contact with the wafer and a second side face which is adjacent to the first side face and deviates from the wafer, the end face of the clamping jaws are fusiform, and the clamping jaws are obliquely arranged, so that an acute angle is formed between the long diagonal line of the fusiform and the reverse direction of the rotation direction of the wafer.

Description

technical field [0001] The invention relates to the technical field of wafer post-processing, in particular to a wafer clamping mechanism and wafer post-processing equipment. Background technique [0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digital and intelligent. A chip is the carrier of an integrated circuit, and chip manufacturing involves technological processes such as chip design, wafer manufacturing, wafer processing, electrical measurement, cutting, packaging, and testing. [0003] In the manufacturing process of integrated circuits, wafers will be exposed to a large number of particles during multiple processes such as film deposition, etching, and polishing. In order to keep the surface of the wafer clean and eliminate the particles remaining on the surface of the wafer during the process, the wafer after each process ...

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Problems solved by technology

[0006] However, there is a problem of sputtering caused by the collision between the sides of the existing jaws and the liquid thrown out of the wafer. Some of the sputtered droplets will fall to the position near the edge of the wafer surface, contaminating the dried area of ​​the wafer. Defects such as water marks are formed, which affect the cleaning and drying effect of the wafer

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