Preparation process of self-sharpening metallic bond diamond abrasive layer
A metal bond and preparation process technology, applied in the field of abrasive tool processing, can solve the problems of difficult control of self-sharpening of finished products, increased manufacturing process difficulty, complex material composition, etc., and achieve the effects of low cost, convenient operation and high preparation efficiency
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Embodiment 1
[0033] The present embodiment provides a kind of self-sharpening metal bond diamond abrasive layer preparation process, such as figure 1 shown, including:
[0034] Mix the basic constituent materials of the abrasive layer according to the set ratio;
[0035] Pretreat the surface of the abrasive tool substrate to obtain a good interface and promote the combination with the abrasive layer;
[0036] Spray the mixed material on the surface of the pretreated abrasive tool substrate by cold spraying to form an abrasive layer;
[0037] Controlling the gap and pore content of the hard and brittle intermetallic compounds formed in the abrasive layer through the heat treatment process to obtain a controllable self-sharpening abrasive layer.
[0038] Further, the basic constituent materials of the abrasive layer include diamond micropowder, high-purity Ni powder and high-purity Al powder, and the mass ratio of each component is: 20-50% of diamond, 30-50% of high-purity Ni powder, and 3...
Embodiment 2
[0053] The preparation process of the self-sharpening metal bond diamond abrasive layer of the present embodiment comprises the following steps:
[0054] Step 1. Mix the basic constituent materials of the abrasive layer according to the set ratio:
[0055] The basic composition material of the abrasive layer is a mixture of high-purity Ni powder 9, high-purity Al powder 10, and core-shell diamond micropowder 8, wherein the high-purity Ni powder 9 has an electrolytic irregular shape and is nearly spherical on the whole, 5-10 μm; High-purity Al powder 10 is prepared by gas atomization, spherical particles, 13-30 μm; core-shell diamond powder 8 has a diamond abrasive grain size of W28, 20-38 μm, and two layers are plated on its surface by chemical plating technology Metal, the middle layer is Ti, the weight gain ratio is 5%, the outermost layer is Ni, the weight gain ratio is 100%, and the coating thickness is 2.6-5.0 μm.
[0056] In order to achieve a higher degree of self-shar...
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