Method for preparing circuit board through composite jet printing process and prepared circuit board
A circuit board and process technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problems of complex equipment and process, low production yield, large material loss, etc., to avoid the stripping process, simplify Process, the effect of exempting from exposure and development
Pending Publication Date: 2022-01-14
北京大华博科智能科技有限公司
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Problems solved by technology
At present, for the large-scale production of traditional copper-based circuit boards, it is usually manufactured by exposure, development, and chemical etching, but this method has large material loss, serious environmental pollution, complex equipment and processes, and low production yield.
With the continuous advancement of technology, inkjet-printable anti-etch inks have appeared, which can eliminate the exposure and development processes, but still need lye to remove the film
Method used
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Embodiment
[0028] A method for preparing a circuit board by a composite jet printing process, comprising the following steps, figure 1 Schematic diagram of the circuit board preparation process. figure 2 For the copper clad laminate in the embodiment, image 3 The sectional view of the copper clad laminate in the embodiment, by image 3 It can be seen that the copper clad laminate is divided into two layers, the upper layer is a thinner copper foil, and the lower layer is the substrate.
[0029] S1: Print A ink on the surface of the copper clad laminate. After the A ink is cured, the A material layer is formed, and the A material layer becomes the line protection coverage area. Figure 4 In the embodiment, the ink A is printed and solidified to obtain the A material layer. S2: Print B ink on the surface of the copper clad laminate. After the B ink is cured, a B material layer is formed, and the B material layer becomes the pad protection coverage area. Figure 5 In the embodiment, ...
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The invention discloses a method for preparing a circuit board through a composite jet printing process. The method comprises the steps that S1, ink A is jet-printed on the surface of a copper-clad plate, the ink A is cured to form an A material layer, and the A material layer becomes a circuit protection coverage area; S2, ink B is sprayed and printed on the surface of the copper-clad plate, a material B layer is formed after the ink B is cured, and the material B layer becomes a bonding pad protection coverage area; S3, a region which is not covered by the ink is etched; S4, the material layer B in the bonding pad area is removed to expose the bonding pad; and S5, jet printing of C ink is carried out, the C ink is cured to form a C material layer, and the C material layer fills the part without copper except the bonding pad area. In addition to the above steps, the method also comprises the steps of character printing, slitting and tin immersion in a rear-segment conventional process for preparing the circuit board. According to the technical scheme, exposure and development can be omitted, meanwhile, the stripping process of the anti-corrosion layer can be omitted, and the manufacturing process of the circuit board can be remarkably simplified.
Description
technical field [0001] The invention relates to the technical field of circuit board preparation, in particular to a method for preparing a circuit board by a composite jet printing process. Background technique [0002] Circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. The circuit board is one of the indispensable accessories in all kinds of modern electronic equipment, but all electronic equipment, whether it is a large machine or a personal computer, a communication base station or a mobile phone, a household appliance or an electronic toy, will use a printed circuit board. [0003] The manufacture of printed circuit boards is crucial in the electronics industry, and insulating inks for circuit boards include anti-etch inks and solder resist inks. The anti-etching ink is used as a barrier layer when corroding the circuit to prote...
Claims
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IPC IPC(8): H05K3/28H05K1/02
CPCH05K3/282H05K3/285H05K1/02
Inventor 张兴业
Owner 北京大华博科智能科技有限公司