Laser solder ball welding equipment for miniature thermistor

Abstract

The invention provides laser solder ball welding equipment for a miniature thermistor. The equipment comprises a rack and a mounting platform, the equipment further comprises a laser solder ball welding device and at least one group of feeding system, the feeding system comprises a pair of jigs, a chip feeding device and a transferring device, the chip feeding device is used for providing to-be-welded chips for wire harnesses on the jigs, and the transferring device is used for moving the jigs to the laser solder ball welding device for welding operation. According to the laser solder ball welding equipment for the miniature thermistor, the full-automatic feeding process of the miniature chips can be achieved, the whole welding automation degree is high, the chip welding machining efficiency, machining precision and the yield can be greatly improved, the laser solder ball welding device is adopted, compared with a traditional tin immersion welding mode, the equipment has the advantages that the welding quality can be greatly improved, the problems of insufficient welding, continuous welding, silver melting, chip lead ablation and the like are avoided, and the efficiency UPH of the whole laser solder ball welding equipment is larger than or equal to 1500.

Description

technical field [0001] The invention relates to the technical field of laser soldering processing of 3C electronic products, in particular to a laser solder ball welding equipment used for micro thermistors. Background technique [0002] Thermistor is a kind of sensitive components. According to different temperature coefficients, it is divided into positive temperature coefficient thermistor (PTC) and negative temperature coefficient thermistor (NTC). The thermistor is characterized by being sensitive to temperature. exhibit different resistance values ​​at different temperatures. With the continuous development of technology, the size of the thermistor is getting smaller and smaller. And the existing thermistor structure is to weld a wire respectively on the positive and negative sides of the chip, and the chip (size is 0.8mm * 0.8mm * 0.35mm) of the miniature thermistor is welded with the wire harness, because the size of the chip is less, It is difficult to realize tra...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the disadvantages of high processing cost, low efficiency and low yield rate of manual feeding in the welding process of the existing micro thermistor, residual solder or even short circuit on the chip caused by immersion tin welding, Provide a laser solder ball welding equipment for miniature thermistors

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