Preparation method of PC alloy resistant to solvent stress cracking

A stress cracking and solvent resistance technology, applied in the field of PC alloy preparation with solvent stress cracking resistance, can solve the problems of lack of solvent resistance and stress cracking resistance of PC alloy, and achieve solvent resistance and stress cracking resistance. The process is simple and the effect of avoiding environmental hazards

Pending Publication Date: 2022-01-25
重庆华众新型材料有限公司
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Problems solved by technology

[0004] However, PC alloys lack solvent resistance and stress cracking resistance, s

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  • Preparation method of PC alloy resistant to solvent stress cracking

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Embodiment Construction

[0033] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0034] The technical solutions provided by various embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0035] see figure 1 , a solvent stress cracking-resistant PC alloy preparation method, including S1: the preparation of PC raw materials; transesterification synthesis PC process ...

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Abstract

The invention relates to the technical field of PC alloy preparation, in particular to a preparation method of a PC alloy resistant to solvent stress cracking, which comprises the step of: S1, preparing a PC raw material. In the process of synthesizing PC (Polycarbonate) by an ester exchange method, the reaction process can be divided into a prepolymerization stage and a condensation polymerization stage according to different polymerization degrees, the prepolymerization stage is mainly influenced by process condition factors, and along with the proceeding of the reaction, the viscosity of a reaction system is continuously increased, and heat and mass transfer becomes the most important factor influencing the reaction in the condensation polymerization stage. The prepolymerization stage is mainly influenced by process condition factors, and along with the proceeding of the reaction, the viscosity of the reaction system is continuously increased and heat and mass transfer becomes the most important factors influencing the reaction in the condensation polymerization stage, so that the process flow for producing PC by using the ester exchange method is simple, the harm to the environment is avoided, the operation condition is improved, meanwhile, a series of complicated post-treatment processes such as washing, desolvation and desalination are avoided, and the method has obvious advantages.

Description

technical field [0001] The present application relates to the technical field of PC alloy preparation, in particular to a method for preparing PC alloy resistant to solvent stress cracking. Background technique [0002] PC alloy is a kind of new material with high performance, functionalization and specialization obtained by physical blending or chemical grafting. PC alloy products can be widely used in automobiles, electronics, precision instruments, office equipment, packaging materials, building materials and other fields; [0003] For example, the Chinese patent discloses: PC / ABS alloy, publication number: CN111825969A, so that electromagnetic radiation is reflected and scattered multiple times on these interfaces, further improving the electromagnetic shielding effectiveness of PC / ABS alloy; [0004] However, PC alloys lack solvent resistance and stress cracking resistance, so a method for preparing PC alloys resistant to solvent stress cracking is proposed. Contents...

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Application Information

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IPC IPC(8): C08L69/00C08L55/02C08L25/12C08L51/00C08G64/24
CPCC08L69/00C08G64/24C08L55/02C08L25/12C08L51/003
Inventor 姚大江
Owner 重庆华众新型材料有限公司
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