Packaging method capable of improving adhesive force of nickel-gold layer

Abstract

The invention provides a packaging method capable of improving the adhesive force of a nickel-gold layer. The packaging method comprises the following steps: 1) providing a substrate, and electroplating a preset position on the surface of the substrate to form a copper layer; 2) electroplating the surface of the copper layer to form a nickel layer; and 3) after an electroplating machine table is electrified, placing the substrate on which the nickel layer is formed into a gold electroplating liquid tank of the electroplating machine table so as to form a gold layer on the surface of the nickel layer through electroplating. In the packaging process, the electroplating equipment is electrified firstly, and then the substrate on which the nickel layer is formed is put into the gold electroplating liquid tank to form the gold layer on the nickel layer through electroplating, so that a replacement reaction between nickel atoms of the nickel layer and gold atoms of the gold electroplating liquid can be effectively avoided, the nickel layer is ensured not to be damaged, the adhesive force between the nickel layer and the gold layer is improved, bubbles are prevented from being generated between the nickel layer and the gold layer, the nickel layer and the gold layer are prevented from falling off, and the product quality can be remarkably improved.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, in particular to a packaging method capable of improving the adhesion of a nickel-gold layer. Background technique [0002] Wafer level packaging (Water Level Packaging, referred to as WLP) technology uses the whole wafer as the packaging and testing object. After the packaging is completed, the wafer is cut into individual finished chips. This process is different from the traditional chip packaging process. very big difference. The chip size packaged by the WLP process can be reduced by more than 20% compared with the chip packaged by the traditional process, so the WLP package has become the mainstream of the packaging market. In the WLP packaging process, the electroplating process is a very important process, and the quality of this process is directly related to the electrical performance of the final product. In the existing WLP packaging process, the substrate with the nickel laye...

AI Technical Summary

Problems solved by technology

[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a packaging method that can improve the adhesion of the nickel-gold layer, which is used to solve the problem of first placing the substrate formed with the nickel layer on the gold plating in the existing packaging process. When electricity is re-energized in the liquid tank, the nickel and gold electroplating solution will undergo a displacement reaction without current. After electroplating, the adhesion between the nickel layer and the gold layer is poor, which will easily cause bubbles and / or nickel to form between the nickel layer and the gold layer. Layer and gold layer fall off, leading to problems such as product performance degradation or even complete failure

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