Laser head device and system for removing soldering tin of integrated circuit board

Abstract

The invention relates to a laser head device and system for removing soldering tin on an integrated circuit board, and the device comprises a control part, a laser device which is used for emitting an incident laser beam, a light guide part in which a light spot homogenizing light path is arranged, and a coaxial visual monitoring part and a coaxial temperature measurement part which are connected to the control part and used for monitoring target soldering tin and measuring the temperature of the target soldering tin; the light spot homogenizing light path comprises a light beam collimating part, a light spot homogenizing part and an integrating lens part which are sequentially distributed along the light beam transmission path, the light spot homogenizing part comprises a displacement part connected to the control part, the displacement part is used for horizontally moving a first one-dimensional single-face cylindrical lens array relative to a second one-dimensional single-face cylindrical lens array and horizontally moving a fourth one-dimensional single-face cylindrical lens array relative to a third one-dimensional single-face cylindrical lens array. The device can output rectangular homogenized light spots which are uniform in energy distribution and adjustable in size, the intensity of the light spots is adjusted according to the temperature of target soldering tin, and the soldering tin removing intensity and reliability are guaranteed.

Description

technical field [0001] The invention relates to the field of laser solder removal, in particular to a laser head device and system for removing solder from an integrated circuit board. Background technique [0002] With the continuous development of my country's electronic technology industry, as one of the necessary and irreplaceable components in electronic and electrical products, the demand for circuit boards has also increased sharply in recent years, and the number of discarded circuit boards has gradually increased. A waste integrated circuit board contains a variety of electronic components and electronic materials, and has a slight radiation, which will have a serious impact on the environment. Therefore, how to efficiently and reasonably dispose of integrated circuit boards and remove the gap between electronic components and circuit boards Soldering is a very important research for the development of my country's electronic technology industry. At present, most of...

AI Technical Summary

Problems solved by technology

In the process of laser solder removal operation, the edge energy with too low energy cannot melt the solder, resulting in incomplete solder removal, and the center energy with too high energy is easy to burn through electronic components and even circuit boards, making it difficult to achieve the strength and reliability of solder removal

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