Polishing solution injection device and polishing system

Abstract

The invention relates to a polishing solution injection device and a polishing system. The polishing solution injection device comprises a fixing mechanism and an injection mechanism, the fixing mechanism is used for fixing the injection mechanism on the polishing surface of the polishing device and does not rotate along with the polishing surface; the injection mechanism sequentially comprises a water scraping part, a water spraying part and a water distributing part in the rotating direction of the polishing surface, the water spraying part is used for spraying out a polishing solution, the water distributing part is used for uniformly distributing the polishing solution sprayed out by the water spraying part on the polishing surface, and the water scraping part is used for scraping off waste liquid generated by polishing on the polishing surface. The polishing solution injection device not only can ensure the uniformity of the material removal rate, but also can avoid the waste of the polishing solution.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical planarization, in particular to a polishing liquid injection device and a polishing system. Background technique [0002] Chemical-mechanical planarization (CMP) technology is one of the key processes in the fabrication of semiconductor devices. Performing multiple planarization treatments on the device surface can provide process windows such as lithography and etching, thereby increasing the device stacking interconnection density. At present, a polishing device is usually used to planarize the device, wherein a polishing liquid needs to be injected into the polishing surface of the polishing device during the polishing process. [0003] In the prior art, the polishing liquid point injection device is usually used to inject the polishing liquid onto the polishing surface of the polishing device. Specifically, the polishing liquid flows through the transportation pipeline in a continu...

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Problems solved by technology

[0005] (1) The circular nozzle at the end of the polishing liquid delivery pipe will cause the spatial distribution of the liquid volume to be more concentrated when the polishing liquid flows out, and then form a smaller and thicker liquid surface on the polishing pad. A bow wave will be formed at the edge of the leading edge, resulting in uneven distribution of the amount of polishing liquid flowing between the wafer and the polishing surface, resulting in an uneven material removal rate effect;

[0006] (2) When the liquid surface of the polishing liquid is relatively thick, when the polishing surface rotates, a considerable part will be thrown out of the polishing surface due to the centrifugal phenomenon, resulting in a great waste of consumables;

[0007] (3) Point-like polishing liquid injection method, due to its lack of control means for the liquid surface state and components of the polishing surface, the effective component concentration of the polishing liquid and the removal rate of the target material will be affected by the driving frequency of the polishing liquid pulse and the polishing pad. Modulation of cleaning state

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