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Packaging adhesive film structure for high-reliability photovoltaic module

A technology for encapsulating adhesive films and photovoltaic modules, which is applied in photovoltaic power generation, films/sheets without carriers, adhesives, etc. It can solve the problems of air bubbles in encapsulation adhesive films, poor filling of adhesive films, increase in manufacturing costs, etc., and improve adhesion performance. , Wide range of applications, the effect of ensuring mechanical strength

Pending Publication Date: 2022-02-08
常州汉韦聚合物有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, with the extension of the outdoor service time of the existing components, the encapsulation film is prone to problems such as bubbles and delamination
And with the emergence of non-busbar cells, as well as the emergence of circular, triangular and other special-shaped ribbons, the problem of poor filling of the adhesive film is prone to occur during the preparation process of the module.
In order to solve these problems, most component factories choose to increase the weight of the film to improve the yield and reliability of the component, but it also increases the manufacturing cost virtually.

Method used

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  • Packaging adhesive film structure for high-reliability photovoltaic module
  • Packaging adhesive film structure for high-reliability photovoltaic module
  • Packaging adhesive film structure for high-reliability photovoltaic module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] An encapsulation film structure for high-reliability photovoltaic modules, the schematic diagram of which is shown in figure 1 As shown, it consists of two non-crosslinked layers 2 and a crosslinked interlayer 1 located in the middle of the non-crosslinked layer 2;

[0025] The material of the non-crosslinked layer 2 used in the two surfaces is a non-crosslinked polymer material, the material of the crosslinked interlayer 1 in the middle is a crosslinked polymer material, and the two surface layers are non-crosslinked POE ( Provided by Andy New Materials, the model is ADSP0012 non-cross-linked POE film), the middle is cross-linked POE (provided by Andy New Materials, model is ADSP0225 cross-linked POE film), according to non-cross-linked type / cross-linked / non-cross-linked in order to prepare the multi-layer adhesive film by hot pressing to obtain the film packaging film structure. The total film thickness of the packaging film structure is about 500 μm. It is about 300...

Embodiment 2

[0035] An encapsulation film structure for high-reliability photovoltaic modules, which has the same structure as figure 1 Same, consisting of two non-crosslinked layers 2 and a crosslinked interlayer 1 located in the middle layer of the non-crosslinked layer 2;

[0036] The material of the non-crosslinked layer 2 used in the two surfaces is a non-crosslinked polymer material, the material of the crosslinked interlayer 1 in the middle is a crosslinked polymer material, and the two surface layers are non-crosslinked POE ( Provided by Andy New Materials, the model is ADSP0012 non-cross-linked POE film), the middle is cross-linked POE (provided by Andy New Materials, model is ADSP0225 cross-linked POE film), according to non-cross-linked type / cross-linked / non-cross-linked in order to prepare the multi-layer adhesive film by hot pressing to obtain the film packaging film structure. The total film thickness of the packaging film structure is about 500 μm. The thickness is about 25...

Embodiment 3

[0038] An encapsulation film structure for high-reliability photovoltaic modules, which has the same structure as figure 1 Same, consisting of two non-crosslinked layers 2 and a crosslinked interlayer 1 located in the middle layer of the non-crosslinked layer 2;

[0039] The material of the non-crosslinked layer 2 used in the two surfaces is a non-crosslinked polymer material, the material of the crosslinked interlayer 1 in the middle is a crosslinked polymer material, and the two surface layers are non-crosslinked POE ( Provided by Andy New Materials, the model is ADSP0012 non-cross-linked POE film), the middle is cross-linked POE (provided by Andy New Materials, model is ADSP0225 cross-linked POE film), according to non-cross-linked type / cross-linked / non-cross-linked in order to prepare the multi-layer adhesive film by hot pressing to obtain the film packaging film structure. The total film thickness of the packaging film structure is about 500 μm. It is about 200 μm thick....

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PUM

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Abstract

The invention discloses a packaging adhesive film structure for a high-reliability photovoltaic module. The packaging adhesive film structure comprises two non-crosslinking layers and at least one crosslinking interlayer located between the non-crosslinking layers. The non-crosslinking layers are made of a non-crosslinking high polymer material, and the crosslinking interlayer is made of a crosslinking high polymer material; the total film thickness of the packaging adhesive film structure is 100-1000 [mu] m; the thickness of the crosslinking interlayer accounts for one third to two thirds of the total film thickness of the packaging adhesive film structure; the surface of the packaging adhesive film structure has good cohesiveness and filling performance, and meanwhile the strength requirement, the production yield and the reliability can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of electronic device components, in particular to an encapsulation adhesive film structure for high-reliability photovoltaic components. Background technique [0002] In recent years, double-glass modules have attracted more attention because of their superior quality compared to traditional modules. Double-glass module is a photovoltaic module composed of two pieces of glass and cells, replacing the backplane and aluminum frame structure of traditional modules. The photovoltaic glass adopted in the early stage is difficult to strike a balance among factors such as price, strength, weight, and light transmittance, so it has not been mass-produced; but with the improvement of photovoltaic glass technology in recent years, it has been able to produce more affordable prices , strong enough and not too heavy products, which improves the quality of photovoltaic modules. Among them, the encapsulating adhesive fi...

Claims

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Application Information

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IPC IPC(8): C09J7/10C09J7/30C09J123/08H01L31/048
CPCC09J7/10C09J7/30C09J123/0815H01L31/0481H01L31/0488C09J2301/208C09J2203/322Y02E10/50
Inventor 施瑕玉初文静林俊良林金锡林金汉
Owner 常州汉韦聚合物有限公司
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