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Ultralow-temperature adhesive and preparation method thereof

An adhesive and ultra-low temperature technology, which is applied in the direction of adhesives, adhesive types, polymer adhesive additives, etc., can solve the problems of affecting application, high brittleness, and reducing the high-temperature performance of adhesives, so as to maintain performance, good toughness, and excellent Effect of Low Temperature Adhesive Strength

Pending Publication Date: 2022-02-08
BEIJING AEROSPACE RATE MECHANICAL & ELECTRICAL ENG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantage of epoxy resin is that it is brittle, especially in ultra-low temperature environments, and its brittleness is more significant, which seriously affects its application.
Toughening methods are usually used to reduce or eliminate brittleness. However, toughening modification brings about improved brittleness and often reduces the high temperature performance of the adhesive.

Method used

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  • Ultralow-temperature adhesive and preparation method thereof
  • Ultralow-temperature adhesive and preparation method thereof
  • Ultralow-temperature adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0026] The manufacturing steps of relevant ultra-low temperature adhesive in the present embodiment are:

[0027] 1) According to the proportion of each component of component A, weigh a certain amount of bisphenol A epoxy resin, AG-80 and polyurethane modified epoxy resin, stir evenly, and set aside;

[0028] 2) According to the ratio of each component of component B, weigh a certain amount of condensate 105, polyetheramine and m-phenylenediamine, stir evenly, and set aside;

[0029] 3) According to the proportions of A, B, and C, weigh a certain amount of B component and a certain amount of C component, add them to the A component in step 1), stir well to make it evenly mixed, It can be used after standing for defoaming;

[0030] 4) the mixture in step 3) is solidified, and the condition is to solidify at a certain temperature for a certain period of time;

[0031] 5) Test method: LY12-CZ hard aluminum alloy is used as the adhered material, the sample is prepared according...

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Abstract

The invention provides an adhesive for low-temperature use and a preparation method thereof. The adhesive is composed of a component A, a component B and a component C. The component A is composed of bisphenol A epoxy resin, AG-80, polyether block flexible epoxy resin and polyurethane modified epoxy resin, the component B is composed of condensed amine 105 # and polyether amine, and the component C is composed of a coupling agent. After the adhesive is subjected to stepped curing at 40 DEG C and 60 DEG C, the shear strength at -196 DEG C is greater than or equal to 20Mpa, and after 10 times of high and low temperature circulation at 100 DEG C and liquid nitrogen temperature, the cured resin has no cracks.

Description

technical field [0001] The invention relates to an ultra-low temperature adhesive and a preparation method thereof, which are suitable for use in an ultra-low temperature environment. Background technique [0002] Ultra-low temperature adhesives refer to adhesives that can be used below -150°C, especially in liquid oxygen (-183°C), liquid nitrogen (-196°C), liquid hydrogen (-253°C) and liquid helium (-269°C), etc. Adhesives with adequate bond strength for use in the environment. [0003] Epoxy resin has excellent bonding performance because of its polar epoxy group, and it is currently an adhesive with better comprehensive performance. However, the disadvantage of epoxy resin is that it is brittle, especially in ultra-low temperature environments, and its brittleness is more significant, which seriously affects its application. Toughening methods are usually used to reduce or eliminate brittleness. However, toughening modification brings about improved brittleness and ofte...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/00C09J11/08
CPCC09J163/00C09J11/08C08L2201/08C08L63/00C08L75/04
Inventor 许冬梅刘元坤虎龙艾青松方心灵李宗家李年华崔正浩陈虹吴中伟潘智勇王瑞岭姜联东高俊
Owner BEIJING AEROSPACE RATE MECHANICAL & ELECTRICAL ENG CO LTD