Method for improving performance of device by optimizing metal etching

Abstract

The invention relates to a method for improving the performance of a device by optimizing metal etching. The method comprises the following steps of: forming a hole structure in an upper cladding of a ridge-shaped optical waveguide; carrying out metal sputtering; etching metal for the first time, aiming a photoetching focal length at the upper part of the ridge-shaped optical waveguide so as to accurately control the tiny distance of the metal; and etching the metal for the second time, concentrating the photoetching focal length in other areas with lower positions to form a final metal shape. According to the method, a smaller distance from the hole to the waveguide can be adapted by optimizing the metal etching process, so that PiN series resistance can be reduced by reducing the distance, and the device performance is improved. The shape of the metal is changed, the metal is distributed on the side wall of the waveguide, the heat dissipation capacity can be improved, the temperature generated in a gas part operation process is not excessively accumulated, and the device stable performance is kept.

Description

technical field [0001] The invention relates to a method for optimizing metal etching and improving device performance. Background technique [0002] Ultra-large-capacity and ultra-high-speed information systems need to use photons instead of electrons as carriers, so optical devices and integrated circuits play a key role. Various optical devices and optoelectronic devices such as optical waveguides, optical modulators, and optical detectors can be made of silicon-based materials. [0003] Optical detectors and optical modulators are very important components in the receiving and transmitting end of silicon photonic integrated circuits. The modulator is a key device for intra-chip optical interconnection in next-generation processors, and its performance directly restricts the development of intra-chip optical interconnection. Existing silicon-based modulators still have various deficiencies in terms of speed, power consumption, and thermal stability. It is highly challen...

AI Technical Summary

Problems solved by technology

However, due to the limitation of the existing processing technology window, the distance from the hole to the waveguide is difficult to reduce, and the series resistance of the device cannot be effectively reduced. Although metal has good thermal conductivity, the existing methods have not utilized its characteristics to improve heat dissipation. ability

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