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Dynamic focusing laser cutting method and device

A dynamic focusing, laser cutting technology, applied in laser welding equipment, welding equipment, metal processing equipment and other directions, to achieve the effect of good reliability, simple and efficient automatic design, and avoid cutting offset

Pending Publication Date: 2022-02-18
帝尔激光科技(无锡)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a dynamic focusing laser cutting method and device, which uses the same laser for dynamic focusing processing, and naturally achieves alignment, avoiding the alignment between one beam of induced laser and another beam of stress laser in the prior art Inaccurate or alignment difficulties, etc., to improve the cutting effect

Method used

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  • Dynamic focusing laser cutting method and device
  • Dynamic focusing laser cutting method and device
  • Dynamic focusing laser cutting method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The first embodiment provides a dynamic focus laser cutting method, such as Figure 1 to Figure 3As shown, when a cutting is completed, only one laser generating device (laser 1 in this embodiment) is needed. After passing through the beam expander 2, the emitted laser light is adjusted into flat-top light by the flat-top light shaper 3, and then passed through the only one The 3D galvanometer (including the 3D module 4 and the 2D galvanometer 5 connected in sequence) and the field mirror 6 for focusing the laser beam form the first focused laser 7 and hit the surface of the product to be processed (ie, the sheet material 9 ), Form the first spot 10, use the first spot 10 to scan along the predetermined cutting line 11 in the first direction through the 2D vibrating mirror, turn on the light when it reaches the predetermined position of the induced cutting groove 12, and turn off the light at other positions, thereby forming the induced cutting groove 12 , the number of...

Embodiment 2

[0047] This embodiment is modified on the basis of Embodiment 1. The laser scans once along the predetermined cutting line 11. During the entire scanning process, the laser light is always turned on, and the first spot 10 is used at the induced cutting groove 12. Other positions of the cutting line 11 use the second light spot 13 .

[0048] Specifically, during processing, the laser scanning path and focusing time are controlled by the 3D vibrating mirror. During one scan, the focus is adjusted to the first spot 10 at the induced cutting groove 12, and the focus is adjusted at other positions on the predetermined cutting line 11. is the second light spot 13. In this processing mode, the second light spot will at least partially cover the cutting induction groove 12 on the cutting path.

[0049] The advantage of this setting is that the laser can complete the non-destructive cutting process after one scan. (The first spot 10 completes the processing of the induced cutting gro...

Embodiment 3

[0051] This embodiment is a modification of Embodiment 1 or Embodiment 2. Its basic principle and structure are the same as Embodiment 1 or Embodiment 2. Change, adjust the distance between the product to be processed and the vibrating mirror. Specific as Figure 6 As shown, other structures remain unchanged, and the 2D oscillating mirror 5 with low cost can be used as the vibrating mirror. In addition, a moving device is provided to drive the 2D vibrating mirror 5 to move up and down. When the 2D vibrating mirror 5 and the field mirror 6 are at a higher position, the first focused laser 7 forms a first spot 10 on the sheet material 9; when the 2D vibrating mirror 5 and the field mirror 6 move to the second When the position 5' and the second position 6' of the field lens, the first focused laser 7 is not refocused, but moves to the second position 7'' of the first focused laser, at this time a second spot is formed on the sheet material 9 13.

[0052] The moving device may...

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Abstract

The invention provides a dynamic focusing laser cutting method and device, one laser is adopted, the divergence angle of the laser is adjusted, or the relative distance between the surface of a to-be-machined product and a laser machining module is adjusted, so that a first light spot or a second light spot is formed on the surface of the to-be-machined product after the laser is focused; at least two points on the predetermined cutting line are scanned by adopting the first light spot to form an induced cutting groove; a second light spot is adopted for scanning along the preset cutting line, thermal stress is formed, and the to-be-machined product is broken along the preset cutting line; the preset cutting line is a line for cutting and separating the to-be-processed product, and the size of the first light spot is smaller than that of the second light spot. The first light spot and the second light spot which are formed by dynamically focusing the same laser are used for scanning, so that the scanning tracks of the first light spot and the second light spot can be completely kept consistent with the preset cutting line, the alignment precision of the induction cutting groove and the thermal stress cutting path is excellent, cutting deviation is avoided, and the cutting effect is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of laser cutting of sheet materials, and in particular relates to a dynamic focusing laser cutting method and device. Background technique [0002] The existing photovoltaic cell cutting technology can adopt the thermal cutting method, that is, focus the laser into a spot of 20-50 μm, repeatedly scratch the surface of the cell along the direction of the cutting line, and form a certain depth of melting groove on the cell, The breaking force is applied externally to separate the cells. This cutting method repeatedly scratches by focusing the light spot, which will cause cutting damage (microcracks) on the cutting section and a large heat-affected zone (Heat Affected Zone, HAZ) on the battery surface, which has a great impact on the electrical properties of the cut battery sheet. . [0003] In order to reduce the damage of the laser to the photovoltaic cells, a non-destructive cutting method has been develop...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/046
CPCB23K26/38B23K26/046
Inventor 程晓伟李志刚朱凡陆红艳张松朱俊
Owner 帝尔激光科技(无锡)有限公司