Dynamic focusing laser cutting method and device
A dynamic focusing, laser cutting technology, applied in laser welding equipment, welding equipment, metal processing equipment and other directions, to achieve the effect of good reliability, simple and efficient automatic design, and avoid cutting offset
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Embodiment 1
[0038] The first embodiment provides a dynamic focus laser cutting method, such as Figure 1 to Figure 3As shown, when a cutting is completed, only one laser generating device (laser 1 in this embodiment) is needed. After passing through the beam expander 2, the emitted laser light is adjusted into flat-top light by the flat-top light shaper 3, and then passed through the only one The 3D galvanometer (including the 3D module 4 and the 2D galvanometer 5 connected in sequence) and the field mirror 6 for focusing the laser beam form the first focused laser 7 and hit the surface of the product to be processed (ie, the sheet material 9 ), Form the first spot 10, use the first spot 10 to scan along the predetermined cutting line 11 in the first direction through the 2D vibrating mirror, turn on the light when it reaches the predetermined position of the induced cutting groove 12, and turn off the light at other positions, thereby forming the induced cutting groove 12 , the number of...
Embodiment 2
[0047] This embodiment is modified on the basis of Embodiment 1. The laser scans once along the predetermined cutting line 11. During the entire scanning process, the laser light is always turned on, and the first spot 10 is used at the induced cutting groove 12. Other positions of the cutting line 11 use the second light spot 13 .
[0048] Specifically, during processing, the laser scanning path and focusing time are controlled by the 3D vibrating mirror. During one scan, the focus is adjusted to the first spot 10 at the induced cutting groove 12, and the focus is adjusted at other positions on the predetermined cutting line 11. is the second light spot 13. In this processing mode, the second light spot will at least partially cover the cutting induction groove 12 on the cutting path.
[0049] The advantage of this setting is that the laser can complete the non-destructive cutting process after one scan. (The first spot 10 completes the processing of the induced cutting gro...
Embodiment 3
[0051] This embodiment is a modification of Embodiment 1 or Embodiment 2. Its basic principle and structure are the same as Embodiment 1 or Embodiment 2. Change, adjust the distance between the product to be processed and the vibrating mirror. Specific as Figure 6 As shown, other structures remain unchanged, and the 2D oscillating mirror 5 with low cost can be used as the vibrating mirror. In addition, a moving device is provided to drive the 2D vibrating mirror 5 to move up and down. When the 2D vibrating mirror 5 and the field mirror 6 are at a higher position, the first focused laser 7 forms a first spot 10 on the sheet material 9; when the 2D vibrating mirror 5 and the field mirror 6 move to the second When the position 5' and the second position 6' of the field lens, the first focused laser 7 is not refocused, but moves to the second position 7'' of the first focused laser, at this time a second spot is formed on the sheet material 9 13.
[0052] The moving device may...
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Abstract
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