High-hardness titanium-based composite material and preparation method thereof
A technology of titanium-based composite materials and high hardness, which is applied in the field of titanium-based composite materials, can solve problems such as hindering development, and achieve the effects of increasing activity, promoting uniformity, and avoiding clusters
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0026] The high-hardness titanium-based composite material of this embodiment is composed of the following components in mass percentage: Al 4.8%, Mo 6%, V 3%, Cr 1.5%, Fe 1.6%, TiC 3.3%, and the balance is Ti, which is inevitable Impurities.
[0027] This embodiment includes the following steps:
[0028] Step 1. Mix the micron-sized TiC particles and the titanium sponge particles evenly, and then seal and wrap them with aluminum foil to obtain an alloy package; the particle size of the micron-sized TiC particles is 2 μm to 5 μm;
[0029]Step 2. Place the alloy package obtained in step 1 on the bottom of the non-consumable vacuum arc furnace crucible, and then mix Al-85V master alloy, Ti-32Mo master alloy, Ti-32Fe master alloy, electrolytic chromium and aluminum beans evenly Put it on the upper part of the alloy ladle, and then carry out 6 times of non-consumable vacuum arc melting to obtain ingots;
[0030] Step 3. Homogenize the ingot obtained in step 2, and then perform h...
Embodiment 2
[0034] The high-hardness titanium-based composite material of this embodiment is composed of the following mass percentages: Al 5.5%, Mo 5%, V 4%, Cr 1%, Fe 2%, TiC 5%, and the balance is Ti, which is inevitable Impurities.
[0035] This embodiment includes the following steps:
[0036] Step 1. Mix the micron-sized TiC particles and the titanium sponge particles evenly, and then seal and wrap them with aluminum foil to obtain an alloy package; the particle size of the micron-sized TiC particles is 2 μm to 5 μm;
[0037] Step 2. Place the alloy package obtained in step 1 on the bottom of the non-consumable vacuum arc furnace crucible, and then mix Al-85V master alloy, Ti-32Mo master alloy, Ti-32Fe master alloy, electrolytic chromium and aluminum beans evenly Put it on the upper part of the alloy ladle, and then carry out 7 times of non-consumable vacuum arc melting to obtain ingots;
[0038] Step 3. Homogenize the ingot obtained in step 2, and then perform hot rolling treatme...
Embodiment 3
[0042] The high-hardness titanium-based composite material of this embodiment is composed of the following components in mass percentage: Al 4.5%, Mo 5.6%, V 3.5%, Cr 2%, Fe 1%, TiC 4%, and the balance is Ti, which is unavoidable of impurities.
[0043] This embodiment includes the following steps:
[0044] Step 1. Mix the micron-sized TiC particles and the titanium sponge particles evenly, and then seal and wrap them with aluminum foil to obtain an alloy package; the particle size of the micron-sized TiC particles is 2 μm to 5 μm;
[0045] Step 2. Place the alloy package obtained in step 1 on the bottom of the non-consumable vacuum arc furnace crucible, and then mix Al-85V master alloy, Ti-32Mo master alloy, Ti-32Fe master alloy, electrolytic chromium and aluminum beans evenly Put it on the upper part of the alloy ladle, and then carry out 8 times of non-consumable vacuum arc melting to obtain ingots;
[0046] Step 3. Homogenize the ingot obtained in step 2, and then perfor...
PUM
Property | Measurement | Unit |
---|---|---|
Particle size | aaaaa | aaaaa |
Rockwell hardness value | aaaaa | aaaaa |
Rockwell hardness value | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com