Terminal structure, package, and method for manufacturing terminal structure

A manufacturing method and structure technology, applied in the field of terminal structure, can solve problems such as deterioration of bonding strength between metallized layers and lead terminals, and achieve the effect of improving bonding strength

Pending Publication Date: 2022-02-22
NGK电子器件株式会社 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the bonding strength between the metal

Method used

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  • Terminal structure, package, and method for manufacturing terminal structure
  • Terminal structure, package, and method for manufacturing terminal structure
  • Terminal structure, package, and method for manufacturing terminal structure

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0050]

[0051] figure 1 It is a top view of the structure of the high frequency module 701 in the first embodiment. Further, regarding the cover 730, in order to easily observe the view, only the outer edge is shown in a double dotted line. figure 2 It is a top view of the configuration of the package 501 for obtaining the high frequency module 701.

[0052] High frequency module 701 ( figure 1) Has a package 501 ( figure 2 ), The cover 730 and the internal circuit 750. The internal circuit 750 has an IC (integrated circuit) 751. The IC751 can have a high operating frequency, specifically, may have an operating frequency of 55 GHz or more. The internal circuit 750 can also have an optical member 752, in which case the high frequency module 701, and the package 501 are optical modules and a light seal. The optical member 752 is, for example, a laser diode.

[0053] The package 501 has a terminal configuration 301 and a housing 530. The housing 530 has a casing 532 and a plate bo...

Example Embodiment

[0083]

[0084] Figure 13 It is a partial plan view of the structure of the terminal structure 304 in the second embodiment. In the present embodiment, the trench TR includes a portion between the connection layer 25 and the signal pad 21, and a portion between the connection layer 25 and the signal pad 22. Further, the signal pad 21 is completely surrounded by the edge ED and the trench TR on the main surface of the base 10. Specifically, the signal pad 21 has a quadrilateral shape having a 1 side composed of an edge ED and a 3 side composed of a trench TR. In addition, Figure 13 In the example shown, in the region of the diagonal direction from the signal pad 21, the trench TR is not formed on the main surface of the base 10. As a modification, it is also possible to construct 305 as a terminal ( Figure 14 In such a way, a trench TR is formed on the main surface of the base 10 in the region from the signal pad 21.

[0085] Further, with respect to the above configuration, sinc...

Example Embodiment

[0088]

[0089] Figure 15 It is a partial plan view of the structure of the terminal structure 306 in the third embodiment. Figure 16 Be along Figure 15 A rough partial cross-sectional view of XVI-XVI.

[0090] Terminal construction 306 has a signal pad 21a (first pad) and a signal pad 22a (fourth pad), instead of terminal construction 301 ( Image 6 as well as Figure 7 : The signal pad 21 and the signal pad 22 of the first embodiment. In the present embodiment, the trench TR includes a portion between the signal pads 21a and the signal pad 22a, but does not include a portion between the signal pads 21a and the ground pad 26 and the signal pad 22a and the ground pad 27. Part of the part. Therefore, the main surface MS of the base body 10 is flat between the signal pads 21a and the ground pads 26 and the ground pads 27 and the signal pads 22a. As a result, the signal pad 21a is different from the signal pad 21, only one end of the lateral direction (specifically, along the directi...

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Abstract

A substrate (10) is composed of insulating ceramics and has a major surface (MS) provided with a trench (TR), wherein the trench (TR) includes a flat surface (FP) continuous with the major surface (MS). A first pad (21) is provided on the major surface (MS) of the substrate (10), and is composed of metal. A lead (321) is provided on the first pad (21) so as to be electrically connected to the first pad (21). The first pad (21) has a side surface (FS) on an extrapolated surface of the flat surface (FP) of the trench (TR). In at least one cross-sectional view taken perpendicular to the major surface (MS) of the substrate (10), the first pad (21) has a first thickness (T1) at a central point in a direction parallel to the major surface (MS), and has a second thickness (T2) at the side surface (FS), wherein a thickness condition that the second thickness (T2) be greater than half the first thickness (T1) is satisfied.

Description

technical field [0001] The present invention relates to a terminal structure, a package, and a method for manufacturing the terminal structure, and in particular, to a terminal structure having leads provided on pads, a package with the terminal structure, and a method for manufacturing the terminal structure. Background technique [0002] International Publication No. 2014 / 192687 (Patent Document 1) discloses an element housing package intended to improve frequency characteristics in a high frequency band. This package has a concave portion between a lead terminal joined to a wiring conductor and a ground terminal joined to a ground layer. The recess makes it easy to arbitrarily set the capacitive coupling between the wiring conductor and the ground layer. [0003] JP-A-2003-283033 (Patent Document 2) discloses a package for storing an optical semiconductor element. The package has lead terminals and metallization layers bonded to each other by solder. With the miniaturi...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L23/64H01L21/48H01L21/60
CPCH01L23/49548H01L23/642H01L21/4885H01L24/43H01L2224/438H05K1/11H01L23/13H01L23/12H05K3/40
Inventor 石崎正人久保昇大西笃
Owner NGK电子器件株式会社
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