PCB manufacturing process for 5G base station communication

Abstract

The invention discloses a PCB manufacturing process for 5G base station communication, and particularly relates to the technical field of PCBs, and the manufacturing process comprises the following specific manufacturing steps: preparing raw materials for manufacturing the PCB, then forming a groove matched with the size of a PCB body in the inner side of an arc-shaped seat when the PCB body is integrally assembled, and promoting the PCB body to carry out the installation work based on the interior of the groove; laying a heat dissipation graphite layer on the inner side of the groove, installing multiple sets of shielding covers, and installing multiple sets of magnetic rings on the outer side of the arc-shaped base. Through the structural integration of the protective cover, the antenna plate and the arc-shaped filter plate and the concave structure arrangement of the groove in the inner side of the base and the PCB body, the protective cover and the base can be directly spliced into a whole, and the internal antenna plate, the arc-shaped filter plate and the PCB body can work safely and stably; the thickness and the quality of PCB structure integration are greatly simplified, and the convenience and the working efficiency of base station assembling operation are improved.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a PCB manufacturing process for 5G base station communication. Background technique [0002] The wireless communication base station refers to the radio transceiver station that transmits information between the wireless communication switching center and the wireless terminal in a certain radio coverage area. The receiving mode of the base station is that the antenna receives the signal, and the signal is transmitted to the PCB board through the filter. Also known as printed circuit board, it is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components; [0003] When the current PCB board is manufactured and assembled, it is often necessary to install components such as filters, receiving antennas, and protective covers outside the board to ensure that the PCB board is placed outside for commu...

AI Technical Summary

Problems solved by technology

[0003] When the current PCB board is manufactured and assembled, it is often necessary to install components such as filters, receiving antennas, and protective covers outside the board to ensure that the PCB board is placed outside for communication. However, due to the higher integration of the configured components, the structure It is relatively complicated, which increases the weight and volume of the PCB board, and increases the difficulty factor of the overall assembly of the base station, and the PCB board may be subjected to vibration and shock caused by human or external objects during production, assembly and actual use, so that the PCB board Loose or misplaced components will reduce the protection of the PCB board and the stability of communication work. In addition, during the communication period of the PCB board, it may be interfered by external signals, resulting in too slow signal processing efficiency of the PCB board or incomplete reception of information. When the PCB board is in operation, it will generate a lot of heat. This heat is easy to concentrate on the surface of the circuit board, which is difficult to discharge from the disk, and reduces the communication quality and fault tolerance rate of the PCB board.

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