Silicon-based high-rejection-ratio single-sideband modulator chip

Abstract

The invention discloses a silicon-based high-rejection-ratio single-sideband modulator chip which comprises a silicon-based dual-parallel Mach-Zehnder modulator (DP-MZM) with an adjustable splitting ratio and a notch filter. A continuous optical signal is input into the silicon-based double-parallel Mach-Zehnder modulator, a microwave signal to be modulated is divided into two paths of signals with equal amplitude and 90-degree phase difference through the 90-degree bridge, and the two paths of signals are respectively input into a radio frequency input end of the silicon-based double-parallel Mach-Zehnder modulator to realize an optical single-side-band signal. The splitting ratio adjustable splitter based on a 1 * 2 Mach-Zehnder interference structure is introduced to independently adjust the split light of two arms of the two modulators arranged in parallel and the main modulator, and the asymmetry of the modulators introduced by process errors and the like is effectively compensated. The notch filter further filters stray sidebands, and the sideband rejection ratio of the single sideband signal is improved. The invention has the advantages of large working bandwidth, high rejection ratio and the like.

Description

technical field [0001] The invention relates to electro-optical modulation technology and integrated photon technology, and belongs to the field of silicon-based single-sideband modulators. Background technique [0002] The explosive growth of information transmission in modern society has put forward higher and higher requirements for information transmission and exchange. Faced with such a large-scale data exchange and transmission volume, electrical interconnection has long been unable to meet the demand. In contrast, low-loss, low-cost, and large-bandwidth optical interconnection has become the basic way for communication backbone network interconnection. In addition, the birth of technologies such as big data and cloud computing has also made the optical interconnection of the data center replace the traditional electrical interconnection. On a smaller scale, chip-level optical interconnection technology is also maturing. [0003] As a key device in optical interconne...

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Problems solved by technology

[0008] The present invention is based on the existing electro-optical modulation technology and single sideband modulation technology, aiming at the problem that the working bandwidth of the traditional dual-parallel Mach-Zehnder modulator is not large enough and the rejection ratio is not high enough , propose a silicon-based high rejection ratio single sideband modulator chip

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