Wet etching machine for chip production

Abstract

The invention discloses a wet etching machine for chip production, which comprises a wafer wet etching device, a wafer washing device and a wafer drying device, and is characterized in that the wafer wet etching device comprises a first rack, and an etching conveying roller group is mounted on the first rack; a plurality of spaced etching conveying belts are installed between the pair of etching conveying roller sets, the wafer washing device comprises a first conveying assembly and a second conveying assembly which are connected with each other, and a spraying washing mechanism device for spraying ultrapure water to the upper surface and the lower surface of a wafer is installed in the top of the washing cavity. The wafer drying device comprises a fourth machine frame, an upstream conveying device, a drying conveying device and a downstream conveying device are sequentially installed on the fourth machine frame, the drying conveying device comprises a plurality of drying conveying rollers, the wet etching machine can complete etching, cleaning and drying of wafers, residual etching liquid on the surfaces of the wafers can be removed more thoroughly, and the etching efficiency of the wafers is improved. And the wafer can be better and thoroughly dried.

Description

technical field [0001] The invention relates to a wet etching machine for chip production, which is used for the production and processing of semiconductor wafer chips. Background technique [0002] Wafer is the basic material for manufacturing semiconductor chips. Wet etching removes the surface material of silicon wafers through chemical reagents. Generally, the wet etching process is completed on a wet etching machine. The wet etching machine mainly includes an etching device, Washing device and drying device, but the current etching device uses a suction cup to absorb and fix the wafer and then sprays the etching solution. When the wafer is in place, the suction cup rises to absorb the wafer, and sprays the etching solution from above the wafer. After etching and sending out the cavity, the wafer above the suction cup often breaks during operation, causing a large amount of etching liquid to enter the vacuum pipeline, solenoid valve, etc., causing serious consequences to...

AI Technical Summary

Problems solved by technology

[0002] Wafer is the basic material for manufacturing semiconductor chips. Wet etching removes the surface material of silicon wafers through chemical reagents. Generally, the wet etching process is completed on a wet etching machine. The wet etching machine mainly includes an etching device, Washing device and drying device, but the current etching device uses a suction cup to absorb and fix the wafer and then sprays the etching solution. When the wafer is in place, the suction cup rises to absorb the wafer, and sprays the etching solution from above the wafer. After etching and sending out the cavity, the wafer above the suction cup often breaks during operation, causing a large amount of etching liquid to enter the vacuum pipeline, solenoid valve, etc., causing serious consequences to the equipment;

[0003] After the etching is completed, the wafer needs to be washed with water, and the current water washing device is mainly that after the wafer enters the washing room, the spray head in the washing room sprays the surface of the wafer, and the wafer is completed in the process of transportation. After washing with water, some grooves will be formed on the upper surface of the wafer after etching. It is difficult to wash the residual etching solution in these grooves thoroughly by spraying. Therefore, the washing effect of the current washing device is not ideal. , the general solution is to increase the length of the washing chamber to increase the cleaning time, but this leads to an increase in the size of the washing chamber, which also affects the efficiency. At the same time, it cannot ensure that the etching solution in the pattern groove on the upper surface of the wafer is completely removed. ;

[0004] After the washing is completed, the wafers are dried. The traditional drying method is to wait for all 25 wafers to come out and then go to the dryer or drying oven to dry. This will lead to corrosion of the first wafers due to water on the surface. , due to the weak acidity of deionized water, the drying must be completed in a short time, and when the wafer is drying, it is always in contact with other things, and there will be dead spots in the contact place. According to the current research status, in the drying process "Water marks" and dry dead ends are most likely to occur in the environment, in order to solve the problems of "water marks" and dry dead ends

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