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Resin composition, prepreg, film with resin, metal foil with resin, metal foil-clad laminate and wiring board

A technology of resin composition and compound, applied in the direction of metal layered products, synthetic resin layered products, layered products, etc., can solve problems such as poor installation

Pending Publication Date: 2022-03-01
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, as wiring boards become thinner, semiconductor packages with semiconductor chips mounted on the wiring boards are warped, and mounting defects are prone to occur.

Method used

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  • Resin composition, prepreg, film with resin, metal foil with resin, metal foil-clad laminate and wiring board
  • Resin composition, prepreg, film with resin, metal foil with resin, metal foil-clad laminate and wiring board
  • Resin composition, prepreg, film with resin, metal foil with resin, metal foil-clad laminate and wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9 and comparative example 1～3

[0211] In this example, each component used when preparing a resin composition is demonstrated.

[0212] (Styrenic block copolymer: Hardness 70 or less)

[0213] Septon2063: Styrene-isoprene-styrene copolymer (Septon2063 manufactured by Kuraray Co., Ltd., tensile elastic modulus at 25° C.: 0.4 MPa, durometer hardness: 36, structural unit derived from styrene Content 13% by mass, weight average molecular weight 95000)

[0214] Tuftec H1221: Styrene (ethylene / butylene) styrene copolymer (Tuftec H1221 manufactured by Asahi Kasei Co., Ltd., tensile elastic modulus at 25° C.: 1.5 MPa, durometer hardness: 42, structural unit derived from styrene Content 12% by mass, weight average molecular weight 150000)

[0215] Tuftec H1052: Hydrogenated styrene (ethylene / butylene) styrene copolymer (Tuftec H1052 manufactured by Asahi Kasei Co., Ltd., tensile elastic modulus at 25° C.: 5 MPa, durometer hardness: 67, structural unit derived from styrene content of 20 mass%, weight average molec...

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Abstract

One aspect of the present invention relates to a resin composition containing: a first styrene-based block copolymer having a hardness of 20-70; a polyphenylene ether compound having a group represented by formula (1) and / or a group represented by formula (2) in the molecule; and a curing agent. In formula (1), p represents 0-10, Z represents an arylene group, and R1-R3 each independently represents a hydrogen atom or an alkyl group. In formula (2), R4 represents a hydrogen atom or an alkyl group.

Description

technical field [0001] The present invention relates to a resin composition, a prepreg, a resin-coated film, a resin-coated metal foil, a metal foil-clad laminate, and a wiring board. Background technique [0002] In various electronic devices, as the amount of information processing increases, mounting technologies such as higher integration of mounted semiconductor devices, higher density of wiring, and multilayering are being developed. In addition, as wiring boards used in various electronic devices, for example, wiring boards compatible with high frequencies, such as millimeter-wave radar boards used in automotive applications, are required. In order to increase the signal transmission speed and reduce the loss during signal transmission, the substrate material used to form the insulating layer of the wiring board used in various electronic devices requires a low dielectric constant and a low dielectric loss factor. [0003] It is known that polyphenylene ether has exc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L53/02C08L71/12C08K9/06C08K3/36B32B3/14B32B15/082B32B27/00B32B27/30C08F287/00C08F299/02C08J5/24
CPCB32B15/082B32B27/00C08F299/02B32B27/30C08F287/00B32B3/14C08L71/126C08L53/02C08J2371/12C08J2453/02C08J2353/02C08J2471/12C08J5/244C08J5/249C08K9/06C08K3/36C08L53/025C08F290/062H05K1/0366C08J7/0427C08F226/06C08F222/103C08L71/12C08K5/0025C08K5/34924B32B15/08B32B2305/076B32B2457/08C08J5/24H05K1/0373H05K1/036C08K5/06
Inventor 斋藤宏典王谊群井上博晴
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD