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Printed circuit board

A technology of printed circuit boards and external circuits, which is applied in the field of printed circuit boards with embedded structures and its manufacturing, which can solve the problems that the outermost circuit patterns are easy to collapse, and achieve the effect of improving product reliability

Pending Publication Date: 2022-03-01
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, a conventional printed circuit board including a fine circuit pattern has a structure in which the outermost circuit pattern protrudes above the insulating layer, and thus has a problem that the outermost circuit pattern is easily collapsed.

Method used

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  • Printed circuit board
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Embodiment Construction

[0044] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the drawings, but the same or similar elements are denoted by the same reference numerals regardless of the reference numerals, and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' of components used in the following description are given or used interchangeably only in consideration of ease of writing description, and have no meaning or role to distinguish from each other by themselves. In addition, in describing the embodiments disclosed in this specification, if it is determined that a detailed description of related known art may obscure the subject matter of the embodiments disclosed in this specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are only used to make the embodiments disclosed in this specification easier to understand, and the technical ideas disclosed in this specific...

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Abstract

A printed circuit board according to an embodiment includes: a first insulating layer; a first circuit pattern disposed inside the first insulating layer or on a lower surface of the first insulating layer; a second circuit pattern disposed on an upper surface of the first insulating layer; and a second insulating layer disposed on an upper surface of the first insulating layer and surrounding the second circuit pattern, in which the second circuit pattern and the second insulating layer are disposed to protrude on the upper surface of the first insulating layer, and a height of the second circuit pattern is greater than a height of the second insulating layer.

Description

technical field [0001] Embodiments relate to a printed circuit board, and more particularly, to a printed circuit board having an embedded structure in which a circuit pattern provided on an outermost layer is embedded and a method of manufacturing the same in the insulating layer. Background technique [0002] As the miniaturization, weight reduction, and integration of electronic components accelerate, the line width of circuits becomes smaller. In particular, as design rules of semiconductor chips are integrated on a nanoscale, the circuit line width of a package substrate or a printed circuit board on which a semiconductor chip is mounted is reduced to several micrometers or less. [0003] In order to increase the degree of circuit integration of printed circuit boards, that is, various methods have been proposed to miniaturize circuit line widths. In order to prevent loss of circuit line width in an etching step for patterning after copper plating, a semi-additive pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/20H05K3/24H05K3/46
CPCH05K1/0298H05K3/20H05K3/24H05K3/465H05K2203/1377H05K1/0373H05K3/202H05K3/4626H05K3/4644H05K2201/0212H05K2201/0209
Inventor 柳到爀罗世雄明世镐
Owner LG INNOTEK CO LTD