Unlock instant, AI-driven research and patent intelligence for your innovation.

Preparation method of superconducting array structure

An array structure and superconducting technology, which is applied in the manufacture/processing of superconductor devices, superconducting devices, electrical components, etc., can solve the problems of irregular sample shape, easy oxidation of Nb, structural deformation, etc., and meet low requirements for instruments , Avoid deformation effects, reduce the effect of oxidation

Pending Publication Date: 2022-03-04
INST OF PHYSICS - CHINESE ACAD OF SCI
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. Since the Nb islands are deposited after electron beam exposure, the Au-Nb interface at the deposition site may be affected by residual glue, thereby affecting the quality of the sample
[0006] 2. Since Nb is easily oxidized during deposition, which affects its superconducting critical temperature, in order to ensure a higher superconducting critical temperature, it is required that the chamber of the instrument can reach a higher vacuum degree or deposit Nb at a faster rate during deposition.
But for making an island array, such as Figure 7 As shown, due to the irregularity of the exposed area (area other than the circle), electron beam lithography is used, and electrons are scattered in the adjacent substrate to cause optical proximity effect (optical proximity effect), which affects the graphic integrity of the unexposed area. resulting in irregular shape of the final sample
Figure 8 For the samples we fabricated with this protocol, it was demonstrated that electron beam lithography resulted in structural deformations in the case of irregularly shaped exposed areas.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of superconducting array structure
  • Preparation method of superconducting array structure
  • Preparation method of superconducting array structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0060] The present invention will be further described below by way of figures and specific embodiments, but it is understood that these embodiments are used in more detail, and it is not understood to limit the invention in any form. The scope of protection of the present invention is restricted.

[0061] Embodiments of the present invention provide a method of preparing a superconducting array structure.

[0062] In order to prepare a superconducting array structure, a bridge for preparing a superconducting array structure is first obtained.

[0063] Get a bridge for preparing a superconducting array structure on a substrate material, the main steps Figure 10 As shown, including:

[0064] Step 110, growing SiO on a silicon substrate surface 2 Floor;

[0065] Step 120, there will be SiO 2 Layer silicon substrate into a magnetron sputtering device, in SIO 2 On the layer, the magnetron sputter growth Au layer, the NB layer is formed, and the sample to be patterned is formed.

[006...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a preparation method of a superconducting array structure. The preparation method comprises the following steps: coating a positive photoresist on a bridge used for preparing a superconducting array structure on a substrate material, and forming a sample with a positive photoresist masking layer through exposure and development; the bridge for preparing the superconducting array structure comprises a silicon substrate, a SiO2 layer, an Au layer and an Nb layer, wherein the Au layer and the Nb layer are located on the SiO2 layer and located in a superconducting array structure preparation area. The Au layer and the Nb layer are arranged on the SiO2 layer from bottom to top; evaporating an Al layer on the sample; removing the positive photoresist masking layer and the Al layer growing on the positive photoresist masking layer through a solvent stripping process, and cleaning the sample; performing reactive ion etching on the cleaned sample, and removing the Nb layer in the same area as the projection position of the positive photoresist masking layer; and removing the Al layer in an area different from the projection position of the positive photoresist masking layer, and cleaning to obtain the superconducting array structure formed by the Au layer and the residual Nb layer.

Description

Technical field [0001] The present invention relates to the field of thin film microstructure, and more particularly to a preparation method of a superconducting array structure. Background technique [0002] The superconducting array structure is a periodic superconducting island array structure prepared on a metal film. figure 1 The scanning electron micrograph of the superconducting array structure prepared in the embodiment of the present invention is shown. Metal film becomes a superconductor due to superconducting proximity effect. Due to the pattern shape of the structure (such as triangular array, square array, honeycomb array, etc.), cycle size (island spacing), the size (diameter) of the island can be easily changed through microcompression techniques, which can affect samples The magnetic flux state in the magnetic field state provides a valuable research object for the study of superconducting mechanism and magnetic flux. In the material selection, high-quality sample...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L39/24
CPCH10N60/0156
Inventor 裴子玺邱祥冈
Owner INST OF PHYSICS - CHINESE ACAD OF SCI