Flow uniformizing device, process chamber and semiconductor process equipment

Abstract

The invention provides a flow uniformizing device, a process chamber and semiconductor process equipment, the flow uniformizing device comprises an annular support member and an annular cover plate, a concave-convex structure is formed between two opposite surfaces of the annular support member and the annular cover plate, and the concave-convex structure forms a plurality of flow uniformizing cavities arranged at intervals along the radial direction of the annular support member. The connecting channels are arranged between every two adjacent flow uniformizing cavities and used for communicating the flow uniformizing cavities, and the different connecting channels are staggered in the axial direction of the annular supporting piece; an air inlet channel is formed in the annular cover plate, and the air outlet end of the air inlet channel is communicated with the flow uniformizing cavity closest to the outer side of the annular supporting piece; an air outlet channel is arranged in the annular supporting piece, the air inlet end of the air outlet channel is communicated with the flow uniformizing cavity closest to the inner side of the annular supporting piece, and the air outlet end of the air outlet channel is communicated with the interior of the process cavity. According to the technical scheme, on the basis that the flow uniformizing effect is improved, the occupied space is reduced, and the machining difficulty, the maintenance difficulty and the equipment cost are reduced.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a flow equalizing device, a process chamber and semiconductor process equipment. Background technique [0002] With the rapid development of integrated circuits (IC), the continuous reduction of chip size and the continuous increase of etching process procedures, the requirements for the processing accuracy of semiconductor processes are also getting higher and higher. The distribution of plasma and the uniformity of the process The requirements have also increased, which requires continuous optimization of the structure of the process chamber to meet the increasingly high process requirements. [0003] As a chamber inlet device, the uniform flow device plays a vital role in the uniformity and stability of the chamber gas distribution. The existing uniform flow device is generally provided with a uniform flow chamber, and a plurality of uniform flow plates are arranged...

AI Technical Summary

Problems solved by technology

However, the existing flow equalizers need to have enough space in the vertical direction, resulting in an increase in occupied space, and most of the internal parts of the existing flow equalizers are porous structures, which have a negative impact on processing and airtightness. Higher requirements, more difficult processing, and the internal parts cannot be replaced individually. Once there is a problem in any position of the flow uniform device, it can only be replaced as a whole, which increases the difficulty of maintenance and equipment costs.

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