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Adhesive composition, thermosetting adhesive sheet, and printed wiring board

A composition and adhesive technology, applied in printed circuit parts, adhesives, circuit substrate materials, etc., can solve the problems of high melting point, poor bending resistance, low dielectric, etc., and achieve low dielectric constant, The effect of good bending resistance and low dielectric loss tangent

Active Publication Date: 2022-03-11
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, although polyphenylene ether has many advantages as a substrate material with low dielectric properties, it has a very high melting point (softening point) and is hard at room temperature, so it has a disadvantage of poor bending resistance.
For example, as in the resin composition described in Patent Document 2, if about 30% to 50% of the entire resin is composed of polyphenylene ether, the bending resistance tends to deteriorate.

Method used

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  • Adhesive composition, thermosetting adhesive sheet, and printed wiring board
  • Adhesive composition, thermosetting adhesive sheet, and printed wiring board
  • Adhesive composition, thermosetting adhesive sheet, and printed wiring board

Examples

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Effect test

Embodiment

[0055] Hereinafter, examples of the present technology will be described. It should be noted that the present technology is not limited to these examples.

[0056]

[0057] Tuftec H1221: Hydrogenated styrene-based thermoplastic elastomer (Mw120000, styrene ratio: 12%), manufactured by Asahi Kasei Corporation.

[0058] HYBRAR 7125: Hydrogenated styrene-based thermoplastic elastomer (Mw110000, styrene ratio: 20%), manufactured by Kuraray Corporation.

[0059] Tuftec H1041: Hydrogenated styrene-based thermoplastic elastomer (Mw90000, 30% styrene ratio), manufactured by Asahi Kasei Corporation.

[0060] Tuftec H1043: Hydrogenated styrene-based thermoplastic elastomer (Mw110000, styrene ratio 67%), manufactured by Asahi Kasei Corporation.

[0061]

[0062] OPE-2St2200: a modified polyphenylene ether resin (Mn2200) having vinylbenzyl groups at both terminals, manufactured by Mitsubishi Gas Chemical Co., Ltd.

[0063] SA9000: Modified polyphenylene ether resin (Mw1700) having ...

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Abstract

Provided is an adhesive composition having a low dielectric constant and a low dielectric loss tangent, and having good bending resistance. The adhesive composition contains 75-90 parts by mass of a styrene-based elastomer, 3-25 parts by mass of a modified polyphenylene ether resin having a polymerizable group at an end thereof, and a total of 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent per 100 parts by mass of the total of the adhesive composition, and the styrene ratio of the styrene-based elastomer is less than 30%.

Description

technical field [0001] The technology relates to an adhesive composition, a thermosetting adhesive sheet, and a printed wiring board. Background technique [0002] With the increase in speed and capacity of information communication, the trend of increasing the frequency of signals flowing through printed circuit boards has been accelerated. In order to cope with this situation, low dielectric properties such as low dielectric constant and low dielectric loss tangent ( For example, refer to Patent Documents 1 and 2). [0003] Furthermore, although polyphenylene ether has many advantages as a substrate material having low dielectric properties, it has a disadvantage in that it has a very high melting point (softening point) and is hard at room temperature, so it has poor bending resistance. For example, as in the resin composition described in Patent Document 2, if about 30% to 50% of the entire resin is composed of polyphenylene ether, the bending resistance tends to deter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J153/02B32B27/00C09J7/22
CPCB32B27/00C09J7/35C09J2203/326C09J2425/00C09J2471/00C09J2463/00C09J153/025C09J151/08C09J153/02C09J7/22C09J7/387C09J11/06C08L71/12C08L63/00B32B25/08H05K1/03C09J7/381C09J7/255C09J2467/006H05K3/305
Inventor 山本润峯岸利之伊达和宏
Owner DEXERIALS CORP