MicroLED huge transfer chip positioning and flight observation system and observation method

Abstract

The invention belongs to the related technical field of micro device assembly, and discloses a Micro LED mass transfer chip positioning and flight observation system and an observation method, the system comprises a binocular vision assembly comprising a first monocular vision channel and a second monocular vision channel, and the first monocular vision channel comprises a high power lens and a high resolution camera; the second monocular vision channel adopts a low-power lens and a low-resolution camera, and a lens acquisition area of the binocular vision assembly is a flight observation area of the chip; the exciter is used for triggering the falling and transferring process of the chip; and the digital delay pulse generator comprises a plurality of channels, the triggering time and the delay time of each channel are independently controlled and excited, the first monocular vision unit and the second monocular vision unit are respectively connected with one channel, and different delay triggering signals are set to realize accurate capture of the falling tense of the chip. According to the invention, accurate and rapid positioning of the chip and local and global observation of the flight state of the chip can be realized.

Description

technical field [0001] The invention belongs to the related technical field of micro-device assembly, and more specifically, relates to a system and an observation method for the positioning and flight observation of Micro LED mass transfer chips. Background technique [0002] With the development of the semiconductor industry, the integration of electronic components is getting higher and higher, and their feature sizes are getting smaller and smaller. When manipulating, the precision requirements for assembly are also getting higher and higher. This also brings great challenges to the field of micro-device assembly, whose assembly steps mainly include two steps of pick-up and release. According to whether the micro-device is in contact with the receiving substrate during the release process, the existing assembly methods mainly include contact and non-contact methods. Regardless of the method, the assembly device needs to be positioned and aligned with the micro-device du...

AI Technical Summary

Problems solved by technology

The use of visual camera-assisted positioning is a method commonly used in the industry. Due to the limitation of lens processing, the larger the field of view of the lens, the lower its optical accuracy. For the chip on the wafer, the chip size is small, but the number is large. Using a single vision It is difficult for components to meet the requirements of large field of view and high precision at the same time

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