Spray type photoresist coating method

Abstract

The invention discloses a photoresist spraying type gluing method which comprises the following steps: sending a wafer to be processed to a designated area, defining the coordinate of a circle center point of the wafer as (Xi, Yi), defining Xi = Yi, defining the radius of the wafer as R, and setting the advancing range and speed of a spray head along an X axis; the advancing range and speed of the nozzle along the Y axis are set; the distance a and the point (Xi, Yi) of the spray head in the Y-axis direction are defined to be equal to (R + sigma, R + sigma) after the X-axis direction is finished in the spraying process, the distance a and the point (Xi, Yi) of the spray head in the Y-axis direction after the X-axis direction is finished in the spraying process are defined to be equal to a / n, and n is the number of repetition times of the spraying period. And in the spraying period, the temperature of the heating disc is controlled. And t0 is increased to th. According to the method provided by the invention, the film on the surface of the wafer can be uniform, good and bubble-free, the problem of poor uniformity can be solved by matching with a covering type spray type gluing action, and bubbles deposited on the surface of the photoresist film are reduced.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and more specifically relates to a photoresist spray coating method. Background technique [0002] Semiconductor manufacturing process, including wafer manufacturing, photolithography, etching, diffusion, ion implantation, thin film deposition and other processes. Among them, the photolithography process is an important pattern forming link. Photolithography is a key process in semiconductor manufacturing. Photolithography is the process of transferring the geometric pattern on the mask to the photosensitive film material (commonly known as photoresist) coated on the surface of the semiconductor wafer. The main steps of pattern formation in photolithography are glue coating, exposure and development. Spray coating has the characteristics of high material utilization rate, no influence of substrate morphology, good repeatability and large coating area, and is widely used in photolitho...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcomings in the prior art. The method can make the film on the surface of the wafer uniform and free of bubbles. Cooperating with the covering spray glue coating action, the problem of poor uniformity can be solved, and the deposition of bubbles on the light can be reduced. Resist film surface