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Processing method of novel high-precision molybdenum alloy wafer

A processing method and molybdenum alloy technology, applied in the field of molybdenum alloy processing, can solve the problems of low yield and poor controllability of rough grinding, and achieve the effect of improving yield and production efficiency

Pending Publication Date: 2022-04-12
江苏时代华宜电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the deficiencies of the above-mentioned prior art, the present invention provides a novel processing method for high-precision molybdenum alloy discs, the purpose of which is to solve the technical problems of poor controllability and low yield of coarse grinding in the existing process

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  • Processing method of novel high-precision molybdenum alloy wafer
  • Processing method of novel high-precision molybdenum alloy wafer
  • Processing method of novel high-precision molybdenum alloy wafer

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Embodiment 1

[0019] The new high-precision molybdenum alloy wafer provided in this example is as follows:

[0020] Processing method of new high-precision molybdenum alloy wafer, including rolling, annealing, heating, heating, complement, secondary annealing, vibration cutting, cleaning, and testing.

[0021] The rolling is to heat and cross rolling of the molybdenum alloy slab material so that the plate embryo is guided outwardly.

[0022] The annealing is to eliminate stress, in order to restore the rolled molybdenum alloy plate, eliminate residual stress and processing hardened due to deformation, while reducing the plastic-brittle transition temperature, increasing plasticity, ensuring the smooth progress of the subsequent process.

[0023] The heating improving is based on the characteristics of "plastic-brittle transformation", and the improving process should be carried out on the critical temperature of plastic-brittle transition. The molybdenum alloy plate is to be placed in a hydroge...

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Abstract

The invention belongs to the technical field of molybdenum alloy processing, and particularly relates to a processing method of a novel high-precision molybdenum alloy wafer, which comprises the steps of rolling, annealing, heating and punching, heating and re-pressing for flattening, secondary annealing, vibration cutting, cleaning and blow-drying, and inspection. According to the machining method of the novel high-precision molybdenum alloy wafer, the problems that in the prior art, coarse grinding is poor in controllability and low in yield are solved, a series of machining procedures such as coarse grinding, vertical mill chamfering and grinding are replaced with a vibration grinding mode, the production efficiency is improved, and the yield of production can be increased.

Description

Technical field [0001] The present invention belongs to the field of molybdenum alloy processing, and more particularly to the processing method of a new high-precision molybdenum alloy wafer. Background technique [0002] Molybdenum alloy is a rare high melting point metal, not only has good mechanical properties such as high strength, high stiffness, good anti-wear performance, but also has physical chemical properties such as the expansion coefficient of silicon and good thermal conductivity, conductivity. The molybdenum alloy has high melting point, good high temperature performance, good thermal conductivity, small expansion coefficient, good thermal shock resistance, strong anti-wear performance, high acoustic speed, etc., so that it is chemical, metallurgy and metal processing The electronics industry, aerospace and nuclear industry, and military and other areas have been widely used and is one of the difficult-melted metal materials that are very useful in the prospect. A...

Claims

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Application Information

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IPC IPC(8): B24B1/04B23P15/00
Inventor 陈敏王晖郭丽萍
Owner 江苏时代华宜电子科技有限公司