Method for recycling environment-friendly semiconductor chip wafer with reusable mucilage glue

Abstract

The invention discloses a recycling method for an environment-friendly semiconductor chip wafer with reusable adhesive. The recycling method specifically comprises the following steps that S1, a semiconductor chip to be recycled is conveyed to a recycling device through feeding conveying equipment; and S2, starting the recovery processing device to sequentially carry out adhesion, cutting and scraping recovery processing. The invention relates to the technical field of semiconductor chip production. According to the recycling method for the environment-friendly semiconductor chip wafer with the reusable adhesive, the adhesive tape can be replaced by the reusable adhesive mechanism for repeated recycling, the purpose of conveying and cutting the chip wafer in a practical and environment-friendly mode is well achieved, the production cost is greatly reduced, and the production efficiency is improved. The device is simple in structure and convenient to operate, waste of a large amount of adhesive tape is avoided, serious pollution of the adhesive tape to the environment is prevented, meanwhile, cutting, discharging and adhesive removing can be combined, integrated semiconductor chip recycling is carried out, and the labor intensity of workers is greatly reduced.

Description

Technical field [0001] The present invention relates to the technical field of semiconductor chip production, in particular, a reusable environmentally friendly semiconductor chip wafer recovery method. Background technique [0002] In order to achieve energy saving and environmental protection of electronics, recycled semiconductor chips will be recycled, during the recovery process of semiconductor chips, it is necessary to cut the chip wafer, mainly for each of the wafers. The grain is cut separately to recover the crystal grains for classification and reuse. In the process of cutting the crystal grains, first put the back surface of the chip wafer to a tape, then send it to the wafer cutting machine to cut After the cutting is completed, the grain will be in order to place the organized arrangement on the tape, and due to the support of the frame to prevent the crystal grain caused crash, thereby facilitating the semiconductor chip cutting recovery process crystal grains. Han...

AI Technical Summary

Problems solved by technology

[0008] Aiming at the deficiencies of the prior art, the present invention provides an environmentally friendly semiconductor chip wafer recycling method with reusable glue, which solves the problem that the existing wafer cutting equipment uses a large amount of tape during the cutting process, and the tape sticks to the wafer. After the circle is cut, the tape is cut off, and the tape and the cut wafer are removed at the same time, the tape is torn off, and the tape is discarded directly, which will cause a lot of waste of tape and environmental pollution. The adhesive mechanism replaces the adhesive tape for repeated recycling, which cannot achieve the purpose of conveying and cutting the chip wafer that is both practical and environmentally friendly, and the production cost is relatively high. The combination of glue removal and integrated semiconductor chip recycling cannot achieve the purpose of fast and efficient chip wafer recycling.

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