High-voltage silicon stack GPP chip multi-layer stacking and assembling device

Abstract

The invention discloses a high-voltage silicon stack GPP chip multilayer stacking assembly device, which belongs to the technical field of diode assembly, and comprises a first feeding mechanism, two main shaft carrying mechanisms, two groups of second feeding mechanisms, a third feeding mechanism, a clamping turnover mechanism, an elastic pressing mechanism and a material receiving platform which are fixedly mounted on a workbench, the two main shaft carrying mechanisms are butted together to form a straight line; a graphite boat carrying a lower lead is conveyed to the main shaft carrying mechanism through the first feeding mechanism, tin sheets and crystal grains are placed on the graphite boat through the synergistic effect between the second feeding mechanism and the adsorption mechanism, meanwhile, the graphite boat carrying an upper lead is conveyed to one side of the clamping and overturning mechanism through the third feeding mechanism, and the graphite boat carrying the lower lead is conveyed to the main shaft carrying mechanism through the clamping and overturning mechanism. The clamping and overturning mechanism clamps and overturns the graphite boat loaded with the upper lead to the graphite boat loaded with the lower lead, and the elastic pressing mechanism elastically presses the stacked graphite boats, so that the assembly operation process can be automatically carried out, and the labor intensity of workers is reduced.

Description

technical field [0001] The invention belongs to the technical field of diode assembly, and in particular relates to a high-voltage silicon stack GPP chip multilayer stacking assembly device. Background technique [0002] The high-voltage silicon stack is also called a silicon column. It is a silicon high frequency high voltage rectifier diode. The working voltage is between thousands of volts and tens of thousands of volts. It is often used for high-frequency and high-voltage rectification in black and white TV sets or other electronic instruments. The reason why it can have such a high withstand voltage is that its interior is composed of several silicon high-frequency diode cores connected in series. The outside is packaged with high-frequency ceramics. According to the application requirements, GPP chips are often used for the assembly of high-voltage silicon stacks. When assembling, first stack the tin sheet and crystal grains on the lower lead, and then stack the upp...

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Problems solved by technology

[0004] The object of the present invention is to propose a high-voltage silicon stack GPP chip multilayer stacking assembly device in order to solve the problems of high work intensity, waste of man-hours, and low assembly efficiency caused by the use of traditional assembly devices.

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