Etching solution composition and preparation method thereof
A technology of composition and etching solution, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of accelerating the decomposition of hydrogen peroxide, shortening the life of etching solution, and rising the temperature of the liquid, so as to reduce decomposition and stabilize the etching rate Sex, avoid bumping effect
Pending Publication Date: 2022-04-12
惠州达诚微电子材料有限公司
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Problems solved by technology
[0002] In recent years, due to the rapid development of industries such as semiconductors and display panels, there is not only a strong demand for quantity of electronic chemicals, but also higher and higher requirements for quality. Etching technology is an indispensable process link for semiconductors and display panels. , is also constantly developing and progressing. Among them, wet etching has been used by the industry for a long time as the most effective, stable and extensive etching technology. Metal copper has more excellent electrical conductivity and is widely used as metal interconnection lines. Therefore, the current Most of the etching is carried out around copper or copper alloy. The copper etching solution currently on the market is mainly composed of hydrogen peroxide, sulfuric acid and deionized water. The generated copper oxide reacts to generate soluble divalent copper ions. On the one hand, the divalent copper ions generated during the etching process will continue to oxidize metal copper to generate monovalent copper ions due to their own oxidation. With continuous accumulation, the etching rate will become faster and faster and become uncontrollable; on the other hand, copper ions accelerate the decomposition of hydrogen peroxide, thereby shortening the life of the etching solution. At the same time, the temperature of the liquid rises sharply during the process, which may easily lead to safety accidents
Method used
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Embodiment 1
[0049] Embodiment 1: the investigation of mineral acid
[0050] Prepare the etching solution composition according to the prescription described in Table 1.
[0051] Table 1: Screening of Inorganic Acids
[0052]
[0053]
[0054]
Embodiment 2
[0055] Embodiment 2: the investigation of organic acid
[0056] Prepare the etching solution composition according to the prescription described in Table 2.
[0057] Table 2: Screening of Organic Acids
[0058]
[0059]
Embodiment 3
[0060] Embodiment 3: the investigation of complexing agent
[0061] Prepare the etching solution composition according to the prescription described in Table 3.
[0062] Table 3: Screening of Complexing Agents
[0063]
[0064]
[0065]
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The invention provides an etching liquid composition and a preparation method thereof, and belongs to the field of etching liquid compositions. The composition comprises hydrogen peroxide, a complexing agent, organic acid, hydrochloric acid, nitric acid, inorganic salt, a copper corrosion inhibitor, a hydrogen peroxide stabilizer and water. The etching liquid composition has the advantages of good morphology after etching, no residue, no damage to ITO, good stability of etching rate, good safety, good stability of hydrogen peroxide and the like.
Description
technical field [0001] The invention belongs to the field of etching liquid compositions, and in particular relates to an etching liquid composition and a preparation method thereof. Background technique [0002] In recent years, due to the rapid development of industries such as semiconductors and display panels, there is not only a strong demand for quantity of electronic chemicals, but also higher and higher requirements for quality. Etching technology is an indispensable process link for semiconductors and display panels. , is also constantly developing and progressing. Among them, wet etching has been used by the industry for a long time as the most effective, stable and extensive etching technology. Metal copper has more excellent electrical conductivity and is widely used as metal interconnection lines. Therefore, the current Most of the etching is carried out around copper or copper alloy. The copper etching solution currently on the market is mainly composed of hydr...
Claims
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IPC IPC(8): C23F1/18H01L21/3213
Inventor 卢燕燕张丽燕
Owner 惠州达诚微电子材料有限公司