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Test method, device and equipment for memory chip and medium

A technology of memory chips and testing methods, which is applied in the direction of electronic circuit testing, etc., can solve the problems of time, manpower, and cost, and achieve the effect of shortening test time and improving test efficiency

Pending Publication Date: 2022-04-12
SHENZHEN TIGO SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a memory chip testing method, device, equipment and medium to solve the problem in the prior art that a lot of time and manpower are spent on the memory chip after the automatic mass production test and then the simulated real environment test

Method used

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  • Test method, device and equipment for memory chip and medium
  • Test method, device and equipment for memory chip and medium
  • Test method, device and equipment for memory chip and medium

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0049] Such as figure 1 Distance figure 1 A flow diagram of a test method of a memory chip provided in Example 1 of the present invention. This method is applied to test the computer. Specifically, such as figure 1As shown, the method includes the following steps S101-S103.

[0050] S101, if the test instruction is received, the sending system level test start command to the mobile phone test motherboard.

[0051] Specifically, if the test computer receives the test instruction, send the system-level test start command to the mobile test motherboard, the system-level test start command is used to make the mobile phone test motherboard to simulate the memory chip to simulate real environment tests. The simulated real environment test is divided into screen click, APP operation, video playback, response speed, multiplexing machine, and MEMTEST memory test.

[0052] The screen click test is an application of the analog LPDDR chip during the test process. By integrating test software,...

Embodiment 2

[0060] See figure 2 , figure 2 A flow diagram of a test method of a memory chip provided in Example 2 of the present invention. This method is applied to test the computer. The test method of the memory chip of the second embodiment includes steps S201-S205, wherein step S201-S203 is similar to step S101-S103 in the first embodiment, and details are not described herein again. The steps S204-S205 increasing in this embodiment will be described in detail below.

[0061] S204, if the result of the simulated real environment test is passed, the transmission level test start command to the integrated circuit automatic test machine.

[0062] Specifically, the level test start command is used to enable the integrated circuit automatic tester to level the memory chip to level according to a preset test software, and a preset condition.

[0063] Due to the characteristics of LPDDR chip products (different from different customers' demand), the ATE part will be divided into a variety of co...

Embodiment 3

[0078] See image 3 , image 3 A flow diagram of a test method of a memory chip provided in Example 3 of the present invention. The method is applied to the mobile phone test motherboard. The test method of one memory chip of Embodiment 3 includes steps S301-S304.

[0079] S301, receive the system-level test start command that the test computer is sent.

[0080] Specifically, the mobile phone test motherboard receives the system-level test start command that the test computer is transmitted.

[0081] S302, the memory chip is simulated to simulate the real environment test on the system-level test start command.

[0082] Specifically, after the mobile phone test motherboard receives the system-level test start command transmitted by the test computer, the mobile phone test motherboard is simulated real environment test of the memory chip.

[0083] S303 feeds back the results of the simulated real environment test to the test computer.

[0084] Specifically, the mobile phone test moth...

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Abstract

The invention relates to a memory chip test method, device, equipment and medium, and relates to the technical field of semiconductor chip test.The method is applied to a test computer and comprises the steps that if a test instruction is received, a system-level test start command is sent to a mobile phone test mainboard; receiving a real environment simulation test result fed back by the mobile phone test mainboard; and if the result of the simulation real environment test is failure, sending a first test stop command to the mobile phone test mainboard, and sending a second test stop command to the integrated circuit automatic test machine. Therefore, after the real environment simulation test is carried out on the memory chip, whether the automatic mass production test is carried out or not is determined according to the result of the real environment simulation test, so that the test time is shortened, and the test efficiency is improved.

Description

Technical field [0001] The present invention relates to the field of semiconductor chip test, in particular, to a test method, apparatus, apparatus, and medium of a memory chip. Background technique [0002] At present, the mainstream LPDDR package finished product test can be divided into three phases: the first stage is EVB, the second phase is ATE, the third stage is the SLT. General EVB refers to the laboratory test phase, this time is the correctness of the chip design, and ATE is automated production test, generally testing whether the function and performance of the chip have failed. The SLT is to simulate real environment tests, system-level tests. [0003] The prior art is to simulate real environment test after automated production testing, and due to automated production testing, a large amount of time is used to divide a lot of useful different grades, but it is also possible to simulate real environment tests. It is considered a non-good product, then a lot of time a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 李创锋
Owner SHENZHEN TIGO SEMICON
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