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Multi-chamber cleaning method and semiconductor process equipment

A process equipment and multi-chamber technology, which is applied in the field of multi-chamber cleaning methods and semiconductor process equipment, can solve the problems of low cleaning efficiency and achieve the effects of improving utilization, efficiency, and cleaning efficiency

Pending Publication Date: 2022-04-15
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the application provides a multi-chamber cleaning method and semiconductor process equipment to solve the problem of low cleaning efficiency of traditional multi-chamber cleaning solutions

Method used

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  • Multi-chamber cleaning method and semiconductor process equipment
  • Multi-chamber cleaning method and semiconductor process equipment
  • Multi-chamber cleaning method and semiconductor process equipment

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Embodiment Construction

[0043] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application. In the case of no conflict, the following embodiments and technical features thereof can be combined with each other.

[0044] The first aspect of the present application provides a multi-chamber cleaning method, which is applied to semiconductor process equipment including multiple chambers, and each chamber shares a gas detection device. Refer to figure 1 As shown, the above multi-chamber cleaning method includes step S410 and step S420.

[0045] S410, performing a cleaning process on each of the chambers ...

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Abstract

The invention discloses a multi-chamber cleaning method and semiconductor process equipment, the multi-chamber cleaning method is applied to the semiconductor process equipment comprising a plurality of chambers, each chamber shares one gas detection device, and the multi-chamber cleaning method comprises the following steps: S410, performing a cleaning process on each chamber at the same time; and S420, circularly detecting the concentration of the detection object in the gas product in each chamber in the cleaning state by adopting a gas detection device, and judging that the cleaning of the corresponding chamber is completed when the concentration of the detection object is smaller than the set concentration. According to the invention, the cleaning efficiency of each chamber of the semiconductor process equipment can be improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor process control, in particular to a multi-chamber cleaning method and semiconductor process equipment. Background technique [0002] After the wafer has completed the deposition or filling process, the remote plasma source will activate the plasma to clean the corresponding chamber lining, and clean the excess elements attached to the lining. Taking CVD (Chemical Vapor Deposition) process as an example to fill metal tungsten in the trench and the corresponding tungsten cleaning process, the main function of the filling metal tungsten is to use silicon tetrahydrogen (SiH4), Reducing gases such as diborane (B2H6) and hydrogen (H2) react with tungsten hexafluoride (WF6) to form a metal tungsten film on the wafer. The growth process of the film is generally divided into soaking (Soak), nucleation ( Nucleation) and bulk deposition (Bulk) and other steps, the ultimate goal is to achieve...

Claims

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Application Information

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IPC IPC(8): H01J37/32H01L21/67
Inventor 尹凌风张军王帅伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD