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A kind of taiko wafer transmission method

A wafer, unified technology, applied in the direction of conveyor objects, sustainable manufacturing/processing, climate sustainability, etc., can solve the problems of Taiko wafer damage efficiency, low, machine alarms, etc.

Active Publication Date: 2022-06-03
GUANGZHOU CANSEMI TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a method for transmitting Taiko wafers, to solve the problems in the prior art that the large amount of deformation of the Taiko wafers and the pick-up manipulator collide during the transmission process, causing the machine to alarm, and the manual adjustment is easy to cause all problems. Discuss Taiko Wafer Breakage and Inefficiency

Method used

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  • A kind of taiko wafer transmission method
  • A kind of taiko wafer transmission method
  • A kind of taiko wafer transmission method

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Embodiment Construction

[0034] The specific embodiments of the present invention will be described in more detail below with reference to the schematic diagrams. The advantages and features of the present invention will become more apparent from the following description. It should be noted that, the accompanying drawings are all in a very simplified form and in inaccurate scales, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention.

[0035] This embodiment provides a method for transferring Taiko wafers 100. Specifically, please refer to the appendix figure 2 -Attached image 3 , figure 2 A flow chart of a method for improving the transfer success rate of Taiko wafers on the backside metal sputtering machine provided by an embodiment of the present invention; image 3 A top view of the Taiko wafer on the wafer flipper provided by an embodiment of the present invention; combined with Figure 2-Figure 3 It can be clearly seen that...

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Abstract

The present invention provides a method for transferring Taiko wafers, including using a wafer flipper to clamp a sample Taiko wafer, and then rotating the sample Taiko wafer, when the positioning point of the sample Taiko wafer is rotated to a candidate calibration alignment position, obtain the amount of deformation of the sample Taiko wafer; secondly obtain the demarcated alignment position of the positioning point of the Taiko wafer according to the deformation value; finally place the positioning point of the Taiko wafer to be transmitted in the Align with the calibration alignment on the wafer flipper. In the method provided by the invention, the whole transmission process does not require manual intervention, and effectively improves the transmission success rate of Taiko wafers.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a Taiko wafer transfer method. Background technique [0002] Metal oxide semiconductor devices are widely used in portable electronic equipment, automotive electronics, industrial control and other fields due to their low price, mature technology, fast switching speed, and simple driving. Wafers need to be thinned to specific thicknesses in the final stages of device fabrication. However, when the entire 12-inch wafer is thinned to a thickness of less than 200 μm, the wafer is as soft as paper, and the transmission capacity of the equipment cannot meet the requirements of automatic production. To solve this problem, the industry uses a method of thinning only the inner area of ​​the wafer while retaining a specific area of ​​the outer ring of the wafer (usually a few millimeters) as a flat support for the wafer. The wafer produced by this process is called Taiko wafer....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/68H01L21/66
CPCH01L21/67742H01L21/67718H01L21/68H01L22/12H01L22/20Y02P70/50
Inventor 曾婵
Owner GUANGZHOU CANSEMI TECH INC