Packaging structure, circuit board assembly and electronic equipment

A circuit board assembly and packaging structure technology, applied in the direction of printed circuit components, circuits, printed circuits, etc., can solve the problems of ceramic board cracking, endangering personal safety, and DBC packaging structure is easy to charge, so as to ensure the insulation effect and strengthen the strength Effect

Pending Publication Date: 2022-04-19
HUAWEI DIGITAL POWER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when an electronic component breaks down and explodes, the impact of the internal air pressure of the DBC package structure will cause the ceramic plate t...

Method used

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  • Packaging structure, circuit board assembly and electronic equipment
  • Packaging structure, circuit board assembly and electronic equipment
  • Packaging structure, circuit board assembly and electronic equipment

Examples

Experimental program
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Embodiment Construction

[0042] Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application.

[0043] In the description of the embodiments of this application, it should be noted that unless otherwise specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be a detachable connection or a non-detachable connection. A connection; either direct or indirect through an intermediary. Wherein, "fixed" means that they are connected to each other and the relative positional relationship after connection remains unchanged. The orientation terms mentioned in the embodiments of the present application, such as "top", "bottom", etc., are only referring to the directions of the drawings. Therefore, the orientation terms used are for better and clearer description and understanding of the present application. The embodiments do not indicate or imply that the device or element referr...

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PUM

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Abstract

The invention provides a packaging structure with relatively high safety, a circuit board assembly and electronic equipment. The packaging structure comprises a first substrate, an electronic component and a plastic package part. The first substrate comprises a first ceramic layer, a first metal layer and a second metal layer, the first ceramic layer is located between the first metal layer and the second metal layer, and the electronic element is fixed on the first metal layer and electrically connected with the first metal layer. The plastic package covers the electronic component and is connected with the first metal layer. The plastic package piece is provided with a groove, and an opening of the groove is located on the outer surface of the plastic package piece. The mechanical strength of the plastic package part provided with the groove is reduced, when the electronic element explodes, air pressure in the packaging structure breaks through the plastic package part firstly, and the problem that the packaging structure is electrified due to short circuit of the first metal layer and the second metal layer is solved.

Description

technical field [0001] The present application relates to the technical field of packaging, in particular to a packaging structure, a circuit board assembly and electronic equipment. Background technique [0002] Direct bonding copper (DBC, direct bonding copper) substrates are widely used in the field of packaging technology due to their excellent high-voltage resistance performance. The DBC substrate includes two layers of copper plates and a ceramic plate between the two layers of copper plates. A traditional DBC package structure includes a DBC substrate, a plastic package and electronic components. Plastic packages are used to package electronic components on DBC substrates. However, when an electronic component breaks down and explodes, the impact of the internal air pressure of the DBC packaging structure will cause the ceramic plate to rupture, causing the two layers of copper plates of the DBC to be short-circuited, and the DBC packaging structure is likely to be ...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L23/367H01L23/373H05K1/02H05K1/11H05K1/18H05K5/02H05K7/20
CPCH01L23/49822H01L23/49838H01L23/49833H01L23/367H01L23/3737H05K1/185H05K1/11H05K1/0207H05K5/02H05K7/2039H01L2224/40225H01L2924/1815H01L2924/181H01L2224/32225H01L2224/73265H01L2224/48227H01L2224/48091H01L2224/73221H01L2924/00012H01L2924/00014H01L2924/00
Inventor 杨泽洲易立琼周迪斌姜珂胡笑鲁
Owner HUAWEI DIGITAL POWER TECH CO LTD
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