Resin-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of resin-based diamond grinding wheel

A manufacturing method and technology of plastic encapsulation, applied in the direction of manufacturing tools, abrasives, grinding devices, etc., can solve the problems of low grinding wheel life and poor surface finish of products, and achieve the effect of improving the yield rate and reducing product costs

Inactive Publication Date: 2022-04-22
西安易星新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The object of the present invention is to provide a resin-based diamond grinding wheel for semiconductor plastic package grinding and its

Method used

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  • Resin-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of resin-based diamond grinding wheel
  • Resin-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of resin-based diamond grinding wheel
  • Resin-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of resin-based diamond grinding wheel

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Embodiment Construction

[0040] The specific content of the present invention will be further explained in detail below in conjunction with the examples.

[0041] A resin-based diamond grinding wheel for grinding a semiconductor plastic package according to the present invention is composed of an aluminum alloy substrate and a grinding block bonded to the aluminum alloy substrate;

[0042] The grinding block is obtained by mixing and pressing molding with mass percentages of 40-50% resin binder, 45-50% diamond powder and 5-10% auxiliary agent;

[0043] Wherein, the particle size of the resin binder is 10-50 μm, and the resin binder includes 40-50% brominated epoxy resin, 40-45% polyvinyl acetal modified phenolic resin, 5-10% alumina and 5% by mass percentage. -10% silicon carbide;

[0044] The diamond powder is sieved polycrystalline diamond powder with a particle size of 5-50 μm, and the surface of the polycrystalline diamond powder is metallized and plated with Ni, Ti or Co elements. The auxiliary a...

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Abstract

The invention discloses a resin-based diamond grinding wheel for grinding a semiconductor plastic package body and a manufacturing method of the resin-based diamond grinding wheel. The resin-based diamond grinding wheel is composed of an aluminum alloy base body and a grinding block bonded to the aluminum alloy base body. The grinding block is prepared from, by mass, 40%-50% of a resin binder, 45%-50% of diamond powder and 5%-10% of an auxiliary agent through mixing and compression molding. According to the grinding wheel manufactured according to the formula and the process, the surface of a product cannot be scratched in the grinding process, the yield of customers can be improved, and the product cost of the customers is reduced; and the replacement period of the grinding wheel is prolonged, the time for replacing the grinding wheel is saved, the production cost of a single product of a customer is reduced, and the product competitiveness is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a resin-based diamond grinding wheel for grinding a semiconductor plastic package and a manufacturing method thereof. Background technique [0002] Electronic packaging is an important part of the semiconductor industry. It is in the back-end process of the semiconductor industry. The main processes are wafer back grinding, wafer saw, die attach, and wire bonding. Wire bond, Compound molding, Compound grinding, Compound singulation, Marking, Testing and other processes. Among them, the basic method of grinding the plastic package is to install the special grinding wheel on the automatic precision grinding machine, and use the grinding wheel to grind off the excess material on the back of the plastic package according to the requirements to achieve the desired thickness, while ensuring the surface roughness and smoothness of the grinding surface. . Due to the d...

Claims

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Application Information

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IPC IPC(8): B24D3/28B24D3/32B24D3/34B24D18/00C08L63/00C08L61/14C08K3/22C08K3/34C08K9/02C08K3/04
CPCB24D3/285B24D3/32B24D3/344B24D18/0009B24D18/0054C08L63/00C08L61/14C08K2003/2227C08K3/22C08K3/34C08K9/02C08K3/04
Inventor 殷攀峰
Owner 西安易星新材料有限公司
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