Electroplated diamond wire saw, diamond wire abrasive particle and preparation method of diamond wire abrasive particle

Abstract

The invention discloses an electroplated diamond wire saw, diamond wire abrasive particles and a preparation method of the diamond wire abrasive particles, and the preparation method of the diamond wire abrasive particles comprises the following steps: carrying out thermal reaction treatment on diamond micro-powder to obtain the diamond micro-powder with roughened surface and structure defects; uniformly mixing the diamond micro-powder with the roughened surface and the structure defects with oxide ceramic powder to obtain mixed powder; and the mixed powder is placed in a vacuum environment to be sintered, and the diamond wire abrasive particles are obtained. According to the method, diamond micro-powder is sequentially subjected to thermal reaction treatment, physical mixing treatment with oxide ceramic powder and sintering treatment, the diamond wire abrasive particles are obtained, the self-sharpening performance of the diamond abrasive particles is improved, and the holding strength of a plating layer on the diamond abrasive particles is improved; the cutting efficiency, the machining effect and the service life of the electroplated diamond fretsaw are further improved. The invention further provides the electroplated diamond fretsaw comprising the base wire, the electroplated layer and the diamond wire abrasive particles embedded in the electroplated layer.

Description

technical field [0001] The invention relates to the technical field of abrasives, in particular to an electroplated diamond wire saw, diamond wire abrasive grains and a preparation method of diamond wire abrasive grains. Background technique [0002] Electroplated diamond wire saw is a cutting tool that uses electroplating process to consolidate diamond powder on the wire. Because of its advantages of high cutting efficiency and more environmentally friendly cutting process, it has been widely used in ceramics, stone, magnetic materials and semiconductor materials. and other hard and brittle materials processing fields. Electroplated diamond wire saw is composed of diamond wire abrasive grains, coating and base wire. Among them, the strength and self-sharpening of diamond wire abrasive grains, and the holding strength of diamond wire abrasive grains by the coating will affect the service life, cutting efficiency and processing effect of electroplated diamond wire saws. [...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the holding strength of diamond wire abrasive grains is increased by increasing the thickness of the coating, but too thick coating will reduce the edge height of diamond wire abrasive grains, which will easily cause a series of problems such as difficulty in chip removal and poor processing quality; In addition, the poor self-sharpening of diamond abrasive grains will lead to the passivation of the cutting surface and reduce the cutting efficiency

Images