Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

RFLDMOS device and manufacturing method thereof

A manufacturing method and device technology, which can be used in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., and can solve problems such as process complexity and cost increase

Pending Publication Date: 2022-05-03
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides an RFLDMOS device and a manufacturing method thereof, which are used to solve the problem of increasing process complexity and cost due to the use of a multi-layer Faraday shield in the prior art, and realize the use of a single-layer Faraday shield It can achieve the effect of multi-layer Faraday shield

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • RFLDMOS device and manufacturing method thereof
  • RFLDMOS device and manufacturing method thereof
  • RFLDMOS device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] The present invention is described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the invention, some specific details are set forth in detail. The present invention can be fully understood by those skilled in the art without the description of these detailed parts. In order not to obscure the essence of the present invention, well-known methods, procedures, procedures, components and circuits have not been described in detail.

[0043] Furthermore, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

[0044] Unless the context clearly requires, words like "including" and "including" throughout the application documents should be interpreted as an inclusive meaning rather than an exclusive or exhaustive meaning; that is, the meaning of "including but not limited to".

[0045] In the descri...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS) device and a manufacturing method thereof, which are characterized in that a substrate is provided, an epitaxial layer is formed on the substrate, a thick gate oxide layer is grown above the epitaxial layer, a source region forming region, a partial gate forming region close to a source and a partial drift region forming region close to a gate are opened by photoetching, and the thick gate oxide layer in the photoetching opening region is removed by utilizing a wet etching process. And forming undercuts at the two ends of the remaining thick gate oxide layer, growing a thin gate oxide layer above the epitaxial layer, forming a stepped gate oxide layer by the thin gate oxide layer and the thick gate oxide layer, and performing a subsequent process to form the stepped Faraday shielding case. According to the stepped Faraday shielding case, the breakdown voltage is considered, meanwhile, the hot carrier performance is improved, the resistance to ground of the Faraday shielding case is reduced, the reliability and the frequency characteristic of a device are effectively improved, and the single-layer Faraday shielding case can achieve the effect of a traditional Faraday shielding case with two layers or even three layers; the photoetching level of the Faraday shielding case is reduced, the process is simplified, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to an RFLDMOS device and a manufacturing method thereof. Background technique [0002] RFLDMOS (Radio Frequency Laterally Diffused Metal Oxide Semiconductor, Radio Frequency Laterally Diffused Metal Oxide Semiconductor) is a radio frequency power device with high gain, high linearity, high withstand voltage, and high output power. RFLDMOS devices are widely used in radio frequency base stations, wireless broadcasting stations, radar and other fields. Using power array and multi-chip synthesis, the output power of the product can reach more than 500W. [0003] Faraday shields are often used in RFLDMOS devices. Such as figure 1 As shown, it is shown as a cross-sectional view of an RFLDMOS device with a layer of Faraday shield, an epitaxial layer 12 is provided on a substrate 11, a source region 15 and a drain region 17 are respectively located in a body region 14...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/336H01L23/552H01L29/78
CPCH01L23/552H01L29/66681H01L29/7816
Inventor 遇寒
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products